Spelling suggestions: "subject:"focal plant arrays"" "subject:"focal plans arrays""
1 |
Image quality of optical systems when used with focal plane array detectorsWood, Sean James January 1993 (has links)
No description available.
|
2 |
Improved designs for future thermal imagersIbrahim, Hassan January 2000 (has links)
No description available.
|
3 |
A Prototype Platform for Array Feed DevelopmentNagel, James Richard 20 October 2006 (has links) (PDF)
Radio frequency interference (RFI) is a growing problem for radio astronomers. One potential solution utilizes spatial filtering by placing an array of electrically small antennas at the focal plane of a parabolic reflector. This thesis documents the design and characterization of a prototype array feed and RF receiver that were used to demonstrate the spatial filtering principle. The array consists of a 7-element hexagonal arrangement of thickened dipole antennas tuned to a center frequency of 1600 MHz. The receiver is a two-stage, low-noise frequency mixer that is tunable over the entire L-band. This thesis also documents a new receiver design that is part of an upgrade to the outdoor antenna test range for the National Radio Astronomy Observatory in Green Bank, West Virginia. The array feed was demonstrated on a three-meter parabolic reflector by recovering a weak signal of interest that was obscured by a strong, broadband interferer. Similar results were also obtained when the interferer moved with an angular velocity of 0.1 degree per second, but only when the power in the interferer dominated the signal. The aperture efficiency was measured at 64%, but adaptive beamformers can slightly perturb this value through distortions in the beam pattern. This phenomenon, called pattern rumble, effectively reduced the sensitivity of the radio telescope, and was measured by comparing the SNRs of adaptive beamformers to the SNR of a fixed-weight beamformer. It was found that pattern rumble can reduce the useful integration time by roughly one order of magnitude. It was also found that mechanical instability of the primary reflector introduces a great deal of pattern rumble, even when the interferer is fixed in direction.
|
4 |
Nineteen-Element Phased-Array Feed Development and Analysis on Effects of Focal Plane Offset and Beam Steering on SensitivityWaldron, Jacob S. 16 July 2008 (has links) (PDF)
Presented herein is the design and construction process in the expansion of BYU's seven-element experimental platform to a nineteen-element platform for phased array feed experiments. The nineteen-element system was deployed at the National Radio Astronomy Observatory (NRAO) in Green Bank West Virginia for use on the Green Bank 20-Meter Telescope. Numerical simulations were performed to determine how sensitivity was affected by electronic beam steering and offset of the phased array feed (PAF) relative to the focal plane of the reflector. These simulated results were then compared to experimental data.
|
5 |
Uncooled Infrared Focal Plane Arrays With Integrated Readout Circuitry Using Mems And Standard Cmos TechnologiesEminoglu, Selim 01 January 2003 (has links) (PDF)
This thesis reports the development of low-cost uncooled microbolometer
focal plane arrays (FPAs) together with their integrated readout circuitry for infrared
night vision applications. Infrared microbolometer detectors are based on suspended
and thermally isolated p+-active/n-well diodes fabricated using a standard 0.35 µ / m
CMOS process followed by a simple post-CMOS bulk-micromachining process.
The post-CMOS process does not require any critical lithography or complicated
deposition steps / and therefore, the FPA cost is reduced considerably. The integrated
readout circuitry is developed specially for the p+-active/n-well diode
microbolometers that provides lower input referred noise voltage than the previously
developed microbolometer readout circuits suitable for the diode type
microbolometers. Two FPAs with 64 × / 64 and 128 × / 128 array formats have been
implemented together with their low-noise integrated readout circuitry. These FPAs
are first of their kinds where such large format uncooled infrared FPAs are designed
and fabricated using a standard CMOS process.
The fabricated detectors have a temperature coefficient of -2 mV/K, a thermal
conductance value of 1.55 × / 10-7 W/K, and a thermal time constant value of 36 ms,
providing a measured DC responsivity (& / #8476 / ) of 4970 V/W under continuous bias. The
measured detector noise is 0.69 µ / V in 8 kHz bandwidth, resulting a measured
detectivity (D*) of 9.7 × / 108 cm& / #8730 / Hz/W. The 64 × / 64 FPA chip has 4096 pixels
scanned by an integrated 16-channel parallel readout circuit composed of low-noise
differential transconductance amplifiers, switched capacitor integrators, and
sample-and-hold circuits. It measures 4.1 mm × / 5.4 mm, dissipates 25 mW power,
and provides an estimated NETD value of 0.8 K at 30 frames/sec (fps) for an f/1
optics. The measured uncorrected voltage non-uniformity for the 64 × / 64 array after
the CMOS fabrication is 0.8 %, which is reduced further down to 0.2 % for the
128 × / 128 array using an improved FPA structure that can compensate for the fixed
pattern noise due to the FPA routing. The 128 × / 128 FPA chip has 16384
microbolometer pixels scanned by a 32-channel parallel readout circuitry. The
128 × / 128 FPA measures 6.6 mm × / 7.9 mm, includes a PTAT temperature sensor
and a vacuum sensor, dissipates 25 mW power, and provides an estimated NETD
value of 1 K at 30 fps for an f/1 optics. These NETD values can be decreased below
350 mK with further optimization of the readout circuit and post-CMOS etching
steps. Hence, the proposed method is very cost-effective to fabricate large format
focal plane arrays for very low-cost infrared imaging applications.
|
6 |
Cmos Readout Electronics For Microbolometer Type Infrared Detector ArraysToprak, Alperen 01 February 2009 (has links) (PDF)
This thesis presents the development of CMOS readout electronics for microbolometer type infrared detector arrays. A low power output buffering architecture and a new bias correction digital-to-analog converter (DAC) structure for resistive microbolometer readouts is developed / and a 384x288 resistive microbolometer FPA readout for 35 µ / m pixel pitch is designed and fabricated in a standard 0.6 µ / m CMOS process. A 4-layer PCB is also prepared in order to form an imaging system together with the FPA after detector fabrication.
The low power output buffering architecture employs a new buffering scheme that reduces the capacitive load and hence, the power dissipation of the readout channels. Furthermore, a special type operational amplifier with digitally controllable output current capability is designed in order to use the power more efficiently. With the combination of these two methods, the power dissipation of the output buffering structure of a 384x288 microbolometer FPA with 35 µ / m pixel pitch operating at 50 fps with two output channels can be decreased to 8.96% of its initial value.
The new bias correction DAC structure is designed to overcome the power dissipation and noise problems of the previous designs at METU. The structure is composed of two resistive ladder DAC stages, which are capable of providing multiple outputs. This feature of the resistive ladders reduces the overall area and power dissipation of the structure and enables the implementation of a dedicated DAC for each readout channel. As a result, the need for the sampling operation required in the previous designs is eliminated. Elimination of sampling prevents the concentration of the noise into the baseband, and therefore, allows most of the noise to be filtered out by integration.
A 384x288 resistive microbolometer FPA readout with 35 & / #956 / m pixel pitch is designed and fabricated in a standard 0.6 & / #956 / m CMOS process. The fabricated chip occupies an area of 17.84 mm x 16.23 mm, and needs 32 pads for normal operation. The readout employs the low power output buffering architecture and the new bias correction DAC structure / therefore, it has significantly low power dissipation when compared to the previous designs at METU. A 4-layer imaging PCB is also designed for the FPA, and initial tests are performed with the same PCB. Results of the performed tests verify the proper operation of the readout. The rms output noise of the imaging system and the power dissipation of the readout when operating at a speed of 50 fps is measured as 1.76 mV and 236.9 mW, respectively.
|
7 |
Advancements Toward High Operating Temperature Small Pixel Infrared Focal Plane Arrays: Superlattice Heterostructure Engineering, Passivation, and Open-Circuit Voltage ArchitectureSpecht, Teressa Rose 13 November 2020 (has links)
No description available.
|
Page generated in 1.3511 seconds