According to the fast development of portable electronic devices, their characteristics are inclined to miniature profile and lightweight. Nowadays, the wafer-level package (WLP) has been widely applied in portable electronic devices for its miniature profile and lightweight. It will become the mainstream trend later soon. The normal use of portable electronic devices brings low-frequency random vibrations to the electronic packages inside. Because of the increasing demand of these devices, the reliability of electronic packages subjected to repeated mechanical loads has become an important issue in the contemporary electronic packaging industry. In this paper both numerical and experimental studies were carried out to investigate the reliability life of Ultra-CSP under cyclic bending conditions. We perform four-point cyclic bending with various combinations of amplitudes and frequencies. Then, we do failure analysis in Ultra-CSP by observing the failure modes. A finite element model for the package is built up for dynamic as well as quasi-static analyses. Accumulated plastic work per bending cycle within the critical solder ball were calculated and together with the experimental results the parameters for the Coffin-Manson fatigue equation were fitted. Through finite element analysis we find that the solder ball which located in the corner has higher accumulated plastic work. Therefore, the crack in the solder ball grew more easily. Thus it lets package resistance rise to determine failure. It was observed from the bending experiments that the influence of frequencies on the fatigue life of the solder interconnects is inapparent. However, influence of amplitude is significant. From the results of both experiments and FEA, it was found that for this particular ultra-CSP specimen under cyclic bending conditions, the characteristic life was expressed as