In this dissertation, a predictive (scalable) measurement-based PEEC modeling method for high-frequency interconnects on low-cost FR4 substrates is proposed and demonstrated. The interconnects are modeled with equivalent circuits of scalable building blocks using a rapid and accurate optimization method to fit parameter data up to 10 GHz. The predictive power of the developed scalable models is demonstrated in several extended interconnect structures and the ability to use interpolation to predict the high frequency performance of structures with differently sized building blocks is demonstrated. The usefulness of the proposed modeling method is validated by comparing predictions to measurements both in frequency domain and in time domain. The efficiency and accuracy of the method are also compared with the Advanced Design System (ADS) momentum simulation tool. The results show that this proposed high-frequency interconnect modeling method is very much more efficient in terms of simulation time, while maintaining comparable accuracy, compared to momentum simulations and measured behavior.

This thesis is considered about interconnect PCB with microelectronic and electronic modules and continuing on thesis MODERN CAUSES OF ASSEMBLY MICROELECTRONICS AND ELECTRONICS MODULES. This thesis includes, definition of termomechanical strain in solder joints and description of LTCC technology. Practical part includes characterization the causes of assembly with usage chip component and proposal footprint for PCBs, modules and results of temperature cycling of tested modules.

Face à la demande croissante de débits de données de plus en plus élevées, l’une des principales solutions proposées par la 5G est de densifier le réseau en y intégrant notamment de nouvelles « Small cells ». La réorganisation de l’architecture du réseau mobile pour s’adapter à l’intégration poussée de ces Small cells, fait naître la problématique de la connexion backhaul entre les stations de bases desservant les Small cells et le cœur de réseau. Ainsi, des liaisons backhaul de plusieurs Gb/s de données sont nécessaires pour pouvoir assurer un débit de données d’au moins 100Mb/s à l’utilisateur qui est l’un des objectifs fixés pour la 5G. Les solutions de connexion backhaul sans fils ont un avantage indiscutable face aux coûts de déploiements de fibres optiques qui sont très élevés. Pour augmenter la capacité spectrale des liaisons sans fils, l’utilisation des fréquences millimétriques au-delà de 6 GHz caractérisées par des larges bandes passantes sera prochainement discutée pour la 5G durant le World Radiocommunication Conference 2019. Parmi ces fréquences, les bandes V (57-66GHz) et E (71-76 GHz et 81-86 GHz) ont un intérêt indéniable grâce aux larges bandes passantes disponibles ainsi qu’aux conditions de licenciement peu exigeantes. Les travaux développés dans cette thèse consistent à concevoir des antennes directives à large bande passante permettant d’établir les liens backhaul point-à-point sans fils (LoS). En exploitant les technologies de fabrications à faibles coût telles que l’impression 3D et Printed Circuit Board (PCB) sur des substrats FR4, la conception de deux types d’antenne directives a été étudiée à savoir des antennes lentilles et des antennes réseaux. / In order to address the ever-increasing demand of higher data rates, adding small cells to the existing macrocells infrastructure is one of the most important milestones of the 5G roadmap. With the integration of small cells and the re-organization of the network topology, backhaul bottleneck is the main challenge to address in the near future. Facing the costs of deployments of fiber optic connections, point-to-point wireless backhaul links using millimeter wave (mmW) frequencies are gaining prominence. 5G future frequencies, to be discussed under the World Radiocommunication Conference 2019 (WRC-19) open-up the way towards mmW frequency band where large bandwidths are naturally available. The high bandwidths available at these frequencies enable several Gbps data rate backhaul links, which is un utmost necessity to respect the 100 Mbps user-experienced data rate promised by the 5G standard. Millimeter-wave frequencies in V and E-bands unlicensed/light licensed spectrum are considered as primary candidates for backhaul links. In addition to the light license regime, the high free space path loss experienced at these frequencies is rather beneficial to limit the interference between small cells links. Moreover, the high available bandwidths at V and E-bands enable to achieve multi Gb/s links without using complex modulation schemes. In this thesis, we focused our research study on developing high gain wide-band antennas usable in point-to-point backhaul links in a Line of Sight (LoS) context. Leveraging cost-efficient technologies like 3D printing and Printed Circuit Board (PCB) on FR4 substrates, we studied two high-gain antenna types: lens antennas and flat array antennas.

A combined solution of the Feed-Forward Equalizer (FFE) and Near-End Crosstalk (NEXT) noise cancellation technique was suggested. The techniques increase data throughput and improve link quality in the 20-in FR4 legacy backplane application. Backplane channel loss and coupling noise were measured and characterized to develop the corresponding behavioral channel model. The receiver-side FFE with 4-tap Finite Impulse Response (FIR) filter structure was adopted as the optimum equalizer topology. The 4-tap FIR filter consists of tap delay line with tap-spacing 33 ps and linear tap-gain amplifiers. The tap coefficients were calculated with the Minimum-Mean-Squared-Error (MMSE) algorithm. A 0.18-um CMOS 4-tap FIR filter IC was designed and fabricated. The experiment results showed the 20-Gbit/sec 4-PAM and 10-Gbit/sec NRZ signal were successfully equalized for the 20-in FR4 legacy backplane channel. Moreover, the suggested NEXT noise cancellation technique consists of coarse- and fine-cancellation stages. The 0.18-um CMOS building block ICs such as 7-tap FIR filter, tunable active Pole-Zero (PZ) filter, and a temporal alignment delay line were fabricated. The experiment results showed that 6-dB Signal-to-Noise Ratio (SNR) improvement was achieved by the developed NEXT noise cancellation technique.

This work deals with the metal surface wetting problems of molten lead-free solder and monitoring of ongoing processes at the inter-phase interface using the method of evaluation of the height of the molten solder deducted from the video sequences. The work is aimed at evaluating the metal surface wettability, wetting angle determined. Wettability of the metal surface is compared for different types of surface treatments and for different ages of the measured samples. Measurement is performed at the improved workplace, is used to evaluate the newly derived formula for calculating the wetting angle and created program for automatic evaluation of Picture is used to.

The theoretical part of dissertation is devoted to familiarization with the process of assembly and soldering of PCBs. There are described the selected types of lead-free solder paste, the various procedures of flux deposition, where the greater part is focuses to the printing through template. Also, I analyze the different procedures shouldering and soldering. I focused mainly on the mechanical mounting of SMD components soldering with help convection reflow and soldering in the vapor. In the practical part is described the design of the test PCB, methodology of assembly PCB and soldering various technologies with predefined settings. The analysis of the results is done by a non-destructive x-ray method and destructive micro-cut method. The x-ray method detects the position and size of the voids in the solder. This information is used for faster processing of micro-cut. The micro-cut method is included in the analysis for a more detailed examination of the solder joint. At the end of the thesis, there is a summary of the recommendation that the setting of the manufacturing process increases the quality of the brazed joint.

This thesis mainly deals with the prediction of temperature on the components and the PCB during reflow soldering. The theoretical part describes the particular solder reflow process, types of heat transfer and temperature profiles. The practical part is divided into forecasting temperatures if the conveyor is stopped and the temperature predictions when the conveyor is in motion. In both parts of the measured temperature is compared with the predicted temperatures, which show the success rate of prediction. The last part of this work is part of the simulation, which helps in proper understanding of the issues discussed.

Progress in development of modern LEDs, their long lifetime and high luminous efficacy predetermine them for usage in lighting systems. This master's thesis examines possibilities of application of LEDs in luminaires, parameters of diodes and problems, which can appear in construction of luminaire with LED lighting source. In the practical part of this thesis a luminaire is designed, capable of illuminating traffic signs, vertical surfaces, billboards and fasades. By standards required parameters of a lighting system and adaptability of application must be considered in complex predesign. Simulations of lighting scene, created in special computer software, measurements of optical point’s parameters and construction of real luminaire model using high quality CREE LEDs, are included in analysis of the problem. Parameters of the luminaire were proved by measurements of product’s attributes at light laboratory. There are also some suggestions for improvement and further development of the product.

This diploma thesis deals with the problems of heat transfer on printed circuit boards. The first part consists of a theoretical analysis of the principles of conduction of heat in different environments, comparing the properties of common type’s base materials for PCBs in terms of thermal properties and focuses on heat transfer from the chip. In the following part they are general information about the program ANSYS ® Workbench ™. Next part consists of the basic designs of PCBs and their improving. PCBs thermal properties for different configurations are verified with calculations, simulations and practical measurements. In the last part there are created design recommendations for PCBs design based on the comparison of the results of initial proposals and proposals to improvements.