- About
-
The Global ETD Search service is a free service for researchers
to find electronic theses and dissertations. This service is
provided by the
Networked Digital Library of Theses and Dissertations.
Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
Search results
Showing 1 to 2 of 2 (0.047 seconds)Spelling suggestions: "subject:"gap film"" "subject:"gap file""
| 1 |
Requirements and challenges on an alternative indirect integration regime of low-k materialsHaase, Micha, Ecke, Ramona, Schulz, Stefan E. 22 July 2016 (has links) (PDF)
An alternative indirect integration regime of porous low-k materials was investigated. Based on a single Damascene structure the intra level dielectric SiO2 or damaged ULK was removed by using HF:H2O solutions to create free standing metal lines. The free spaces between the metal lines were refilled with a spin-on process of a low-k material. The persistence of barrier materials and copper against HF solutions, the gap fill behavior of the used spin on glass on different structure sizes and the main challenges which have to solve in the future are shown in this study.
|
| 2 |
Requirements and challenges on an alternative indirect integration regime of low-k materialsHaase, Micha, Ecke, Ramona, Schulz, Stefan E. 22 July 2016 (has links)
An alternative indirect integration regime of porous low-k materials was investigated. Based on a single Damascene structure the intra level dielectric SiO2 or damaged ULK was removed by using HF:H2O solutions to create free standing metal lines. The free spaces between the metal lines were refilled with a spin-on process of a low-k material. The persistence of barrier materials and copper against HF solutions, the gap fill behavior of the used spin on glass on different structure sizes and the main challenges which have to solve in the future are shown in this study.
|
Page generated in 0.0519 seconds