Cost competitiveness is a major driving force in the semiconductor industry. The processing cost of an individual die is directly proportional to its size. Advances in processing technology have shrunk the device sizes in wire-bonded chips, resulting in a smaller die core size. However, the space below wire-bond pads remains relatively underutilized because of the reliability concern that electrical loads transmitted during bonding can cause failures in the underlying devices. Recently, studies have attempted to improve the use of space below wire-bond pads. Hence, the circuits under pads (CUP) structure modified layout rules to include circuits structure under pads, was developed, and extensive qualification work is required to meet reliability standards. The main purpose of this paper is to investigate the damage caused by the wirebonding process of CUP devices on the in-line assembly packaging manufacture. The root cause of wirebonding failures analyzed were based on the CUP structure and several wire bond parameters; such as bonding force, ultrasonic current, bonding time period, capillary type, machine, and wafer source, which were also confirmed with the DOE/JMP engineer technique. Finally, results were also used to implement the corrective action and the assembly yield of CUP Device has been improved, successfully.

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The aim of this thesis is to evaluate the financial situation of Jemnická Stavba, a. s. and subsequent proposals for the improvement of problem areas. The elaborated financial analysis shows the development of the company in 2012-2016. The theoretical part deals with specific indicators and concepts, which are subsequently used in the practical part of this thesis. The practical part contains an evaluation of the internal and external state of the company Jemnická Stavba, a. s. and the subsequent design of the solution. The aim of my diploma thesis is to elaborate high quality financial analyses showing the reality of the company and to propose appropriate measures for the improvement of the current state.