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The growing demand in portable and compact consumer devices and appliances has resulted in the need for the miniaturisation of electronic components. These miniaturised electronic components are sensitive and susceptible to damage by voltages as low as 20V. Electrically conductive styrenic thermoplastics are widely used in electronic packaging applications to protect these sensitive electronic components against electro-static discharge (ESD) during manufacturing, assembly, storage and shipping. Such ESD applications often require the optimal volume resistance range of ≥ 1.0x105 to < 1.0x108 Ω. The best known method to render styrenic thermoplastics conductive is by the incorporation of conductive fillers, such as carbon black but the main limitation is the difficulty in controlling the conductivity level due to the steep percolation curve. Thus the aim of this research is to develop electrically conductive styrenic thermoplastics by blending several styrenic resins with polymeric conductive additives to achieve optimal volume resistance range for ESD applications with the ease in controlling the conductivity level.