- About
-
The Global ETD Search service is a free service for researchers
to find electronic theses and dissertations. This service is
provided by the
Networked Digital Library of Theses and Dissertations.
Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
Search results
Showing 1 to 10 of 34 (0.112 seconds)| 1 |
Analysis of lead free tin-silver-copper and tin-lead solder wetting reactionsAnson, Scott J. January 2007 (has links)
Thesis (Ph. D.)--State University of New York at Binghamton, Dept. of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references.
|
| 2 |
Characterization of lead-free solders for electronic packagingMa, Hongtao, Johnson, R. Wayne, Suhling, J. C. January 2007 (has links) (PDF)
Dissertation (Ph.D.)--Auburn University, 2007. / Abstract. Vita. Includes bibliographic references.
|
| 3 |
Mechanical properties and microstructure invesitigation of SN-AG-CU lead free solder for electronic package applicationsWang, Qing, Johnson, R. Wayne, Gale, W. F. January 2005 (has links) (PDF)
Dissertation (Ph.D.)--Auburn University, 2005. / Abstract. Vita. Includes bibliographic references.
|
| 4 |
Evaluation and improvement of the robustness of a PCB pad in a lead-free environmentLi, Jing. January 2007 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references.
|
| 5 |
Lead-free assembly and reliability of chip scale packages and 01005 componentsLiu, Yueli, Johnson, R. Wayne, January 2006 (has links)
Dissertation (Ph.D.)--Auburn University, / Abstract. Vita. Includes bibliographic references (p.139-147).
|
| 6 |
Solderability & microstructure of lead-free solder in leadframe packagingWoo, Belemy Hok Chung. January 2005 (has links) (PDF)
Thesis (M.Sc.)--City University of Hong Kong, 2005. / At head of title: City University of Hong Kong, Department of Physics and Materials Science, Master of Science in materials engineering & nanotechnology dissertation. Title from title screen (viewed on Sept. 4, 2006) Includes bibliographical references.
|
| 7 |
The kinetics of tin solidification in lead-free solder jointsKirkpatrick, Timothy. January 2006 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Department of Physics, 2006. / Includes bibliographical references.
|
| 8 |
Quantitative assessment of long term aging effects on the mechanical properties of lead free solder jointsVenkatadri, Vikram. January 2009 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2009. / Includes bibliographical references.
|
| 9 |
Synthesis of tin, silver and their alloy nanoparticles for lead-free interconnect applicationsJiang, Hongjin. January 2008 (has links)
Thesis (Ph. D.)--Chemistry and Biochemistry, Georgia Institute of Technology, 2008. / Committee Chair: Dr. C. P. Wong; Committee Member: Dr. Boris Mizaikoff; Committee Member: Dr. Rigoberto Hernandez; Committee Member: Dr. Z. John Zhang; Committee Member: Dr. Z.L. Wang.
|
| 10 |
Investigation of the impact response of Pb-free electronic assemblies and comparison of drop with cyclic 4-point bend testMirza, Fahad. January 2007 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Mechanical Engineering, 2007. / Includes bibliographical references.
|
Page generated in 0.1166 seconds