NDLTD Global ETD Search
  • Refine Query
  • Source
  • Publication year
  • to
  • Language
  • 29
  • 1
  • Tagged with
  • 34
  • 34
  • 34
  • 33
  • 33
  • 23
  • 23
  • 23
  • 19
  • 16
  • 9
  • 9
  • 8
  • 7
  • 6
  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.

Search results

Showing 11 to 20 of 34 (0.086 seconds)
11

Initialization and progression of damage in lead free electronics under drop impact

Iyengar, Deepti Raju, Lall, Pradeep, January 2008 (has links) (PDF)
Thesis (M.S.)--Auburn University, 2008. / Abstract. Vita. Includes bibliographical references (p. 100-111).
12

Flip chip and heat spreader attachment development

Li, Yuquan. Johnson, Robert Wayne, January 2009 (has links)
Thesis (Ph. D.)--Auburn University. / Abstract. Includes bibliographical references (p. 91-100).
13

Explicit finite element modeling in conjunction with digital image correlation based life prediction of lead-free electronics under shock-impact

Shantaram, Sandeep. Lall, Pradeep, January 2009 (has links)
Thesis--Auburn University, 2009. / Abstract. Includes bibliographical references (p. 111-121).
14

Reliability of lead-free and advanced interconnects in fine pitch and high I/O electronics subjected to harsh thermo-mechanical environments

Hinshaw, Robert Bruce. Lall, Pradeep, January 2009 (has links)
Thesis--Auburn University, 2009. / Abstract. Includes bibliographical references (p. 170-177).
15

Evaluation of the effects of processing conditions on shear strength in Pb-free surface mount assembly

Bukhari, Sarfaraz. January 2004 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Department of Systems Science and Industrial Engineering, 2004. / Includes bibliographical references.
16

Thermal management of heat sensitive components in Pb-free assembly

Raut, Rahul. January 2005 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Department of Systems Science & Industrial Engineering, 2005. / Includes bibliographical references.
17

Effects of Lanthanum doping on the microstructure and mechanical behavior of a SnAg alloy

Pei, Min. January 2007 (has links)
Thesis (Ph. D.)--Mechanical Engineering, Georgia Institute of Technology, 2007. / Neu, Richard W., Committee Member ; Sanders, Thomas H. Jr., Committee Member ; Wong, C.P., Committee Member ; McDowell, David L., Committee Member ; Qu, Jianmin, Committee Chair.
18

A systematic approach for selection of best PB-free printed circuit board (PCB) surface finish

Subbarayan, Guhan. January 2007 (has links)
Thesis (Ph. D.)--State University of New York at Binghamton, Department of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references (leaves 203-208).
19

Process analysis and performance characterization of a novel anisotropic conductive adhesive for lead-free surface mount electronics assembly

Ramkumar, S. Manian. January 2008 (has links)
Thesis (Ph. D.)--State University of New York at Binghamton, Department of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references (leaves 278-290).
20

Interfacial reliability of Pb-free flip-chip BGA package

Tang, Zhenming. January 2008 (has links)
Thesis (Ph. D.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Mechanical Engineering, 2008. / Includes bibliographical references.

Page generated in 0.0917 seconds