There is great need to understand the mechanical properties of lead-free alloys—an alternative of lead-based alloys—to address the environmental problems associated with the use of lead-based materials in microelectronics. In this work, the microstructures of Bi57In26Sn17 lead-free alloy were examined using Optical Microscopy and Energy Dispersive X-ray Spectroscopy analysis. The micro-indentation technique was used to study the mechanical properties of Bi57In26Sn17 lead-free alloy. The experimental results of the hardness and contact modulus were presented and discussed. Local creep during the indentation was observed from the load-displacement curves. The Vickers hardness (HV) increases with the decrease of the indentation depth, suggesting that the alloy exhibits indentation size effect.