This is a thesis about different methods that can be used to detect spyware. Methods included are Layered Service Provider, Internet Protocol Helper API, TDI filtering and API hooking. Some firewall testing applications, leak tests, that use methods that can be used by real spyware program to penetrate firewalls have also been examined. The goal was to develop a Windows 2000/XP program that is able to detect as many of our examined leak tests as possible. Our program uses the methods TDI filtering and API hooking for detection of spyware because our study showed that these methods were the best. To evaluate the program it was tested against our examined leak test programs. Our program managed to detect all leak tests except one. / Fredrik Bergstrand cfb@home.se Johan Bergstrand jb78@home.se Håkan Gunnarsson hakan.gunnarsson@klostersfalad.se

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The diploma thesis deals with a matter of a leak testingo of the Schreiner devices in the company Kovolis Hedvikov a.s. The tested components are the heat exchangers made from alloy of aluminium used for automobiles. Due to the impact of porosity texture created during the components casting there is leaking. The analysis was accomplished to find out the most problematic parts of these components. Subsequently the testing and measuring were performed in order to classify the testing and detect its accuracy. The summary and suggested solutions of how to improve the accuracy of measuring of the aluminium components leaking are presented in the conclusion.

High speed separators from Alfa Laval are widely in use for processing flammable and non-flammable liquids. The following work is focusing on the case of non-flammable liquid as the process liquid in case the working area around the equipment may contain quantities of explosive gases. As stated by Alfa Laval documentation, the major risk is leaking of the explosive atmosphere into the separator from the surrounding environment which may result in producing zone 1 or zone 2 of hazardous area classification. Zone 1: Area in which an explosive gas-air mixture is likely to occur for short periods in normal operation.1 Zone 2: Area in which an explosive gas-air mixture is not likely to occur, and if it occurs it will only exist for a very short time due to an abnormal condition.1 According to Alfa Laval design package, there is a need of continuous inert gas injection into the separator during the process in order to reduce the oxygen concentration and keep it in the safe level (inert gas purging) and this policy is aimed to meet the requirements of ATEX-directive 94/9/EC/2003. The objective of the current thesis is a wish to have a better understanding of the potential risks, evaluating them and try to find ways to ease the process. The outcome can be useful to make a basic instruction for further tests and simplifications as well. The separator GTN 50 is selected and hydrogen (1% concentration) is used to simulate the explosive atmosphere. The result of the tests indicates that the cooling down stage after normal operation is the only period in which hydrogen will leak into the separator, frame top part and it should be cleaned up before the next start up. A number of recommendations -Ventilation to the fresh air, Water discharges, Pressurized air injectionare also being tested and discussed. Ventilation to the fresh air and injection of pressurized air seem to be applicable A Standard Testing Flow chart is suggested and calculation on real case is considered. A number of additional ideas are also included in the last section.

Radio-frequency microelectromechanical systems (RF~MEMS) are highly miniaturized devices intended to switch, modulate, filter or tune electrical signals from DC to microwave frequencies. The micromachining techniques used to fabricate these components are based on the standard clean-room manufacturing processes for high-volume integrated semiconductor circuits. RF~MEMS switches are characterized by their high isolation, low insertion loss, large bandwidth and by their unparalleled signal linearity. They are relatively simple to control, are very small and have almost zero power consumption. Despite these benefits, RF~MEMS switches are not yet seen in commercial products because of reliability issues, limits in signal power handling and questions in packaging and integration. Also, the actuation voltages are typically too high for electronics applications and require additional drive circuitry. This thesis presents a novel MEMS switch concept based on an S-shaped film actuator, which consists of a thin and flexible membrane rolling between a top and a bottom electrode. The special design makes it possible to have high RF isolation due to the large contact distance in the off-state, while maintaining low operation voltages due to the zipper-like movement of the electrostatic dual-actuator. The switch comprises two separately fabricated parts which allows simple integration even with RF circuits incompatible with certain MEMS fabrication processes. The two parts are assembled by chip or wafer bonding which results in an encapsulated, ready-to-dice package. The thesis discusses the concept of the switch and reports on the successful fabrication and evaluation of prototype devices. Furthermore, this thesis presents research results in wafer-level packaging of (RF) MEMS devices by full-wafer bonding with an adhesive intermediate layer, which is structured before bonding to create defined cavities for housing MEMS devices. This technique has the advantage of simple, robust and low temperature fabrication, and is highly tolerant to surface non-uniformities and particles in the bonding interface. It allows cavities with a height of up to many tens of micrometers to be created directly in the bonding interface. In contrast to conventional wafer-level packaging methods with individual chip-capping, the encapsulation is done using a single wafer-bonding step. The thesis investigates the process parameters for patterned adhesive wafer bonding with benzocyclobutene, describes the fabrication of glass lid packages based on this technique, and introduces a method to create through-wafer electrical interconnections in glass substrates by a two-step etch technique, involving powder-blasting and chemical etching. Also, it discusses a technique of improving the hermetic properties of adhesive bonded structures by additional passivation layers. Finally, it presents a method to substantially improve the bond strength of patterned adhesive bonding by using the solid/liquid phase combination of a patterned polymer layer with a contact-printed thin adhesive film. / QC 20100617