This thesis details an innovative laser diode packaging method to improve the accuracy of the laser locator by modifying the location method and packaging process. This method features its simplicity in the packaging process, the capability in tweaking the rotary angle of the laser diode, and an effective solution to the scaling effect as well as the enhancement in yield. The gripping micro-unit,consisting of a refined micro gripper together with the piezoelectric actuator and coupler,integrates a self-designed rotary adjustment and release unit to enable the micro-rectangle unit such as a laser unit to fine tune the location of the object. It works with the linear stage, platform, and image acquisition system to become the core of the proposed location system. A series of experiments are designed to verify the functionality. A precise linear stage without the rotary axis is applied to control the locator,adjust the location of the laser, and minimize the error from equipment. The result demonstrates its feasibility.

No description available.