The Semiconductor Industry Association (SIA) has identified the integration of copper (Cu) with low-dielectric-constant (low-k) materials as a critical goal for future interconnect architectures. A fundamental understanding of the chemical interaction of Cu with various substrates, including diffusion barriers and adhesion promoters, is essential to achieve this goal. The objective of this research is to develop novel organic polymers as Cu/low-k interfacial layers and to investigate popular barrier candidates, such as clean and modified tantalum (Ta) substrates. Carbon-silicon (C-Si) polymeric films have been formed by electron beam bombardment or ultraviolet (UV) radiation of molecularly adsorbed vinyl silane precursors on metal substrates under ultra-high vacuum (UHV) conditions. Temperature programmed desorption (TPD) studies show that polymerization is via the vinyl groups, while Auger electron spectroscopy (AES) results show that the polymerized films have compositions similar to the precursors. Films derived from vinyltrimethyl silane (VTMS) are adherent and stable on Ta substrates until 1100 K. Diffusion of deposited Cu overlayers is not observed below 800 K, with dewetting occurred only above 400 K. Hexafluorobenzene moieties can also be incorporated into the growing film with good thermal stability. Studies on the Ta substrates demonstrate that even sub-monolayer coverages of oxygen or carbide on polycrystalline Ta significantly degrade the strength of Cu/Ta chemical interactions, and affect the kinetics of Cu diffusion into bulk Ta. On clean Ta, monolayer coverages of Cu will de-wet only above 600 K. A partial monolayer of adsorbed oxygen (3L O2 at 300 K) results in a lowering of the de-wetting temperature to 500 K, while saturation oxygen coverage (10 L O2, 300 K) results in de-wetting at 300 K. Carbide formation also lowers the de-wetting temperature to 300 K. Diffusion of Cu into the Ta substrate at 1100 K occurs only after a 5-minute induction period. This induction period increases to 10 min for partially oxidized Ta, 15 min for carbidic Ta and 20 min for fully oxidized Ta.

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The adhesion of coatings is of high importance in the coating industry and a more thorough understanding of adhesion behavior is required. In this thesis work, seven parameters affecting adhesion of silane-modified poly(urethane urea) (PUSi) coatings on pretreated steel and aluminum substrates were studied. These parameters include substrate type, dry film thickness (20-30 and 60-70 μm), solid content (40, 60, and 70 wt%), resin ratio between two different types of PUSi (PUSi-A: PUSi-B = 70:30, 50:50, and 30:70 wt ratio), crosslinking density, additive, and curing condition. The different pretreatments of substrates include solvent wiping, sandblasting, phosphating, and galvanizing. A commercial paint product (‘yellow topcoat’) was used as a reference for the study of substrates and additives. Several formulations of clearcoat, prepared from the same PUSi resins as the commercial paint product, were mainly used in every experiment. The obtained coatings were tested for their adhesion properties using cross hatch adhesion test, bending test, and humidity resistance test. The film hardness and thermo-mechanical properties were evaluated with König pendulum hardness test and Dynamic Mechanical Analysis (DMA), respectively. Surface energies of all substrates were analyzed with Contact Angle Measurement (CAM). The PUSi-A and PUSi-B resins used in the coating formulations were characterized with Differential Scanning Calorimetry (DSC), Size-Exclusion Chromatography (SEC), and Fourier Transform Infrared Spectroscopy (FT-IR). The results showed a correlation between poor adhesion properties and the relatively low surface energies of some substrates, namely cold-rolled steel (CRS), industrial ACE aluminum, and standard Q aluminum. The use of silane-functional crosslinking agent and silane adhesion promoters in the coatings has greatly enhanced adhesion. The increase in film hardness via increased crosslinking density also did not hinder the adhesion due to the presence of silane groups in the crosslinker. Additionally, increased time and temperature during curing showed positive effects. However, the variation of resin ratio, solid content, and film thickness did not offer significant adhesion improvement in this study. / Adhesionsegenskaperna hos ytbeläggningar är av stor betydelse i färg- och lackindustrin och en djupare förståelse av vidhäftning är av stor betydelse. I detta uppsatsarbete studerades sju parametrar som påverkar vidhäftning av silanmodifierad poly(uretan-urea) (PUSi)-beläggningar på stål- och aluminiumsubstrat. Dessa parametrar inkluderar substrattyp, torr filmtjocklek (20-30 och 60-70 μm), torrhalt (40, 60 och 70 viktprocent), mängdförhållandet mellan två olika typer av PUSi (PUSi-A: PUSi-B = 70:30, 50:50 och 30:70 viktprocent), tvärbindningsdensitet, tillsatsmedel och härdningsbetingelser. Förbehandlingen av substraten inkluderar lösningsmedelsavtorkning, sandblästring, fosfatering och galvanisering. En kommersiell ytbehandlingsprodukt innehållandes gula pigment (gul topplack) användes som referens. Flera formuleringar av klarlack, framställda av samma PUSi-hartser som den kommersiella produkten, användes i det experimentella arbetet. Beläggningarna testades med avseende på deras vidhäftningsegenskaper med ’cross-hatch’-test, böjningstest och fuktbeständighetstest. Filmhårdhet och termomekaniska egenskaper utvärderades med König pendelhårdhetstest respektive Dynamisk Mekanisk Analys (DMA). Ytenergier för alla substrat analyserades med kontaktvinkelmätning (CAM). PUSi-A- och PUSi-B-hartserna som användes i ytbeläggningarna karaktäriserades med Differential Scanning Calorimetry (DSC), Size-Exclusion Chromatography (SEC) och Fourier Transform Infrared Spectroscopy (FT-IR). Resultaten visade en korrelation mellan dålig vidhäftning och låga ytenergier för vissa underlag, främst kallvalsat stål (CRS), industriellt ACE-aluminium och standard Q-aluminium. Användningen av silan-funktionell tvärbindare och en silan-baserad primer förbättrade vidhäftningen avsevärt. Ökningen i filmhårdhet genom högre tvärbindningsdensitet resulterade inte i sämre vidhäftning eftersom tvärbindaren innehåller silan-grupper vilket bidrog till att upprätthålla vidhäftningen. Längre tid och högre temperatur vid härdning gav generellt bättre vidhäftning, liksom tillsats av urea. Att variera mängden bindemedel, torrhalt eller filmtjocklek gav inte någon signifikant påverkan på vidhäftning i denna studie.