The main aim of this paper is using the moiré interferometry to measure interface of the IC package structure materials. The moiré interferometry with high sensitivity can use the fringes to measure displacement field in small structure materials. The objective of this study is to obtain displacement fields the interfacial adhesion of the substrate and epoxy by using the moiré interferometry. The peeling strain, shearing strain and tensile strain at the interface adhesion are distinguished by utilizing the experiment of data of u-displacement fields and v-displacement field. Finally, a turning point of failure, in found.