<p>Patterning of multi crystalline silicon Solar cell is prepared with photolithography etching. Electroless plating is used to get metallization of Nickel contacts. SEM analysis of Nickel deposition and measurement of contact resistance for series and shunt resistance is done. To increase the fill factor, the screen printed electrodes are subjected to different firing temperatures there by increasing the efficiency of solar cell. Nickel-silicide formation at the interface between the Silicon and Nickel enhances stability and reduces the contact resistance, resulting in higher energy conversion efficiency.</p><p> </p>

Patterning of multi crystalline silicon Solar cell is prepared with photolithography etching. Electroless plating is used to get metallization of Nickel contacts. SEM analysis of Nickel deposition and measurement of contact resistance for series and shunt resistance is done. To increase the fill factor, the screen printed electrodes are subjected to different firing temperatures there by increasing the efficiency of solar cell. Nickel-silicide formation at the interface between the Silicon and Nickel enhances stability and reduces the contact resistance, resulting in higher energy conversion efficiency.