Global ETD Search

151	A comparison of bond strengths using the plasma arc curing system, the visible light curing system and the argon laser curing system Faller-Shackleton, Nancy. January 1997 (has links) Thesis (M.S.)--University of Louisville, 1997. / Includes bibliographical references.
152	Clinical trial of orthodontic bonding agents Tringas, Andrew. January 1998 (has links) Thesis (M.S. in oral sciences)--University of Illinois at Chicago, 1998. / Includes bibliographical references.
153	The feasibility of bonding orthodontic brackets to laser treated enamel surfaces Kantorowitz, Zvi, January 1998 (has links) Thesis (M. Sc.)--University of Manitoba, 1998. / eContent provider-neutral record in process. Description based on print version record. Includes bibliographical references.
154	Direct bonding to Adlloy treated amalgam Gross, Michael William, January 1996 (has links) Thesis (M. Cl. D.)--University of Western Ontario, 1996. / eContent provider-neutral record in process. Description based on print version record. Includes bibliographical references.
155	An in vivo and in vitro study of a new orthodontic bonding agent Parks, Meredith S., January 2006 (has links) Thesis (M.S.)--West Virginia University, 2006. / Title from document title page. Document formatted into pages; contains vi, 108 p. : ill. (some col.). Vita. Includes abstract. Includes bibliographical references (p. 52-61).
156	Effects of Applied Loads, Effective Contact Area and Surface Roughness on the Dicing Yield of 3D Cu Bonded Interconnects Leong, Hoi Liong, Gan, C.L., Pey, Kin Leong, Thompson, Carl V., Li, Hongyu 01 1900 (has links) Bonded copper interconnects were created using thermo-compression bonding and the dicing yield was used as an indication of the bond quality. SEM images indicated that the Cu was plastically deformed. Our experimental and modeling results indicate that the effective contact area is directly proportional to the applied load. Furthermore, for first time, results have been obtained that indicate that the dicing yield is proportional to the measured bond strength, and the bond strength is proportional to the effective contact area. It is also shown that films with rougher surfaces (and corresponding lower effective bonding areas) have lower bond strengths and dicing yields. A quantitative model for the relationship between measured surface roughness and the corresponding dicing yield has been developed. An appropriate surface-roughness data acquisition methodology has also been developed. The maximum possible applied load and the minimum possible surface roughness are required to obtain the maximum effective contact area, and hence to achieve optimum yields (both mechanically and electrically). / Singapore-MIT Alliance (SMA) Cu-Cu thermo-compression bonding wafer-wafer bonding
157	Reaction of hydrogen atoms with propene at 77Â°K Yun, Han Bo. January 1962 (has links) Call number: LD2668 .T4 1962 Y85 Hydrogen bonding. Propene. Masters theses
158	Hydrogen bonding structure and dynamics studied by terahertz time-domain spectroscopy Li, Ruoyu January 2014 (has links) No description available. 660
159	Fluid transport across bonded dentin interfaces Yiu, Kar-yung, Cynthia., 姚嘉榕. January 2006 (has links) published_or_final_version / abstract / Dentistry / Doctoral / Doctor of Philosophy Dental bonding. Dental adhesives. Dentin.
160	Some theoretical aspects of cluster chemistry Wales, David John January 1988 (has links) No description available. 541 Bonding in transition metal clusters

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