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Packaging of silicon carbide high temperature, high power devices processes and materials /Liu, Yi, Johnson, R. Wayne, January 2006 (has links) (PDF)
Dissertation (Ph.D.)--Auburn University, 2006. / Abstract. Vita. Includes bibliographic references (p.111-116).
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Thermal management in 3D packagingRavinuthala, Sridhar. January 2008 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Mechanical Engineering, 2008. / Includes bibliographical references.
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