Thesis (M.S.)--University of Wisconsin--Madison, 1943. / Typescript. eContent provider-neutral record in process. Description based on print version record. Includes bibliographical references (leaves 47-48).

by Lam Ka. / Thesis (M.Phil.)--Chinese University of Hong Kong, 2000. / Includes bibliographical references (leaves 54-60). / Abstracts in English and Chinese. / ABSTRACT --- p.i / ACKNOWLEDGEMENT --- p.ii / TABLE OF CONTENT --- p.iii / LIST OF TABLES --- p.v / LIST OF FIGURES --- p.vii / Chapter CHAPTER ONE: --- INTRODUCTION --- p.1 / Chapter 1.1 --- Metal deposition --- p.1 / Chapter 1.2 --- Electroless Nickel Plating --- p.3 / Chapter 1.2.1 --- Historical Review and Applications --- p.3 / Chapter 1.2.2 --- General Chemical Principles --- p.5 / Chapter 1.2.3 --- Previous Studies --- p.7 / Chapter 1.3 --- Scope of Work --- p.12 / Chapter CHAPTER TWO: --- EXPERIMENTAL --- p.13 / Chapter 2.1 --- Bath Composition --- p.13 / Chapter 2.1.1 --- Theoretical Description --- p.13 / Chapter 2.2.2 --- Materials --- p.15 / Chapter 2.2 --- Procedure and Experimental Conditions --- p.17 / Chapter 2.3 --- Characterization of EN Coatings --- p.18 / Chapter 2.3.1 --- Theory --- p.18 / Chapter 2.3.1.1 --- Energy Dispersive X-ray Detection of Scanning Electron Microscopy --- p.18 / Chapter 2.3.1.2 --- Polycrystalline X-ray Diffraction --- p.18 / Chapter 2.3.1.3 --- X-ray Photoelectron Spectroscopy --- p.20 / Chapter 2.3.1.4 --- Microhardness --- p.22 / Chapter 2.3.1.5 --- Corrosion resistance --- p.23 / Chapter 2.3.1.6 --- Thickness Measurement --- p.23 / Chapter 2.4 --- Application --- p.24 / Chapter CHAPTER THREE: --- RESULTS AND DISCUSSION --- p.26 / Chapter 3.1 --- Appearance --- p.28 / Chapter 3.2 --- Microstructure --- p.30 / Chapter 3.2.1 --- Effect of Phosphorus Content --- p.30 / Chapter 3.2.2 --- Effect of heat treatment --- p.32 / Chapter 3.3 --- Corrosion Resistance --- p.37 / Chapter 3.3.1 --- Effect of Phosphorus Content --- p.37 / Chapter 3.3.2 --- Effect of Heat Treatment --- p.45 / Chapter 3.3.2.1 --- Temperature --- p.45 / Chapter 3.3.2.2 --- Cooling Rate --- p.47 / Chapter 3.4 --- Microhardness --- p.49 / Chapter 3.4.1 --- Effect of Phosphorus Content --- p.49 / Chapter 3.4.2 --- Effect of Heat Treatment --- p.49 / Chapter CHAPTER FOUR: --- CONCLUSION --- p.52 / REFERENCES --- p.54

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Thesis--PlanB (M.S.)--University of Wisconsin--Stout, 2001. / Includes bibliographical references.

Thesis (M.S.)--Ohio University, August, 1989. / Title from PDF t.p.

Thesis (M.S.)--University of Wisconsin--Madison, 1937. / Typescript. eContent provider-neutral record in process. Description based on print version record. Includes bibliographical references (leaf 48).

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Over the years, chemical bath deposition (CBD) is being widely used in the fabrication of Cu (In, Ga) Se��� and CdTe based solar cells and photovoltaics. Many chalcogenides have been successfully deposited by this technique and it has received a great deal of attention owing to its low temperature and low-cost nature. CdS, an important layer in heterojunction solar cells and other optoelectronic devices, has been successfully deposited by this technique, which is normally carried out as a batch process. But a major disadvantage of batch CBD is the formation of particles and also unwanted deposition generating a lot of waste and thus resulting in defective devices. In this study, we have developed a continuous flow microreactor for CBD to overcome the drawbacks of batch process. This novel microreactor setup makes use of a micromixer for efficient mixing of the reactant streams and helps in controlling the particle size and distribution before the solution impinges on the hot substrate. CdS semiconductor thin films were successfully deposited on oxidized silicon substrates using the microreactor setup and a batch reactor as well. Comparisons of nanostructured thin films were performed by various characterization techniques. The surface morphology of the deposited films, carried out by AFM, SEM and Dektak surface profiler, clearly indicated an improved film quality in case of microreactor. This setup can also be used to deposit various other compound semiconductor thin films with improved film quality and minimum waste production. / Graduation date: 2005

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