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A thesis submitted to the Faculty of Science, University of the Witwatersrand, Johannesburg, in fulfilment of the requirements for the degree of Doctor of Philosophy. / A quartz microbalance electrode (QME) was constructed for the investigation of the electrochemistry of electroless plating baths. To this end, the electronic oscillator circuitry required for the microbalance was developed from literature examples, and the techniques of forming electrodes and mounting the crystal in an appropriate holder were established. The device thus developed was compact, allowing for in situ frequency and electrochemical measurements to be made in a commercially available 100 mL Metrohm cell. The precision .and accuracy obtained with the home-built device were shown to be adequate for electrochemical research, and the sensitivity was found to be consistent with the value expected from the Sauerbrey equation.(Abbreviation abstract) / Andrew Chakane 2018

by Yeung Chung Kin. / Bibliography: leaves 105-106 / Thesis (M.Ph.)--Chinese University of Hong Kong, 1984

A sustainable electroless copper coating process was developed for plating automotive fasteners shaped from AISI 9255 low carbon, high silicon steel. The objective was to minimize the ionic and organic species present in each step of the plating process. A sulfuric acid solution inhibited with quinine was defined to clean the steel prior to plating. The corrosivity of the solution was examined through electrochemical and weight loss measurements to evaluate the efficiency of the cleaning process at high temperatures and high acid concentrations. An electroless copper coating process was then developed using a simple copper sulfate chemistry inhibited with quinine to extend the possible operating window. Finally, benzotriazole was evaluated as a possible anti-oxidant coating. Accelerated thioacetamide corrosion tests were used to evaluate the corrosion inhibition of benzotriazole on copper coatings.

A sustainable electroless copper coating process was developed for plating automotive fasteners shaped from AISI 9255 low carbon, high silicon steel. The objective was to minimize the ionic and organic species present in each step of the plating process. A sulfuric acid solution inhibited with quinine was defined to clean the steel prior to plating. The corrosivity of the solution was examined through electrochemical and weight loss measurements to evaluate the efficiency of the cleaning process at high temperatures and high acid concentrations. An electroless copper coating process was then developed using a simple copper sulfate chemistry inhibited with quinine to extend the possible operating window. Finally, benzotriazole was evaluated as a possible anti-oxidant coating. Accelerated thioacetamide corrosion tests were used to evaluate the corrosion inhibition of benzotriazole on copper coatings.

A sustainable electroless copper coating process was developed for plating automotive fasteners shaped from AISI 9255 low carbon, high silicon steel. The objective was to minimize the ionic and organic species present in each step of the plating process. A sulfuric acid solution inhibited with quinine was defined to clean the steel prior to plating. The corrosivity of the solution was examined through electrochemical and weight loss measurements to evaluate the efficiency of the cleaning process at high temperatures and high acid concentrations. An electroless copper coating process was then developed using a simple copper sulfate chemistry inhibited with quinine to extend the possible operating window. Finally, benzotriazole was evaluated as a possible anti-oxidant coating. Accelerated thioacetamide corrosion tests were used to evaluate the corrosion inhibition of benzotriazole on copper coatings.

A sustainable electroless copper coating process was developed for plating automotive fasteners shaped from AISI 9255 low carbon, high silicon steel. The objective was to minimize the ionic and organic species present in each step of the plating process. A sulfuric acid solution inhibited with quinine was defined to clean the steel prior to plating. The corrosivity of the solution was examined through electrochemical and weight loss measurements to evaluate the efficiency of the cleaning process at high temperatures and high acid concentrations. An electroless copper coating process was then developed using a simple copper sulfate chemistry inhibited with quinine to extend the possible operating window. Finally, benzotriazole was evaluated as a possible anti-oxidant coating. Accelerated thioacetamide corrosion tests were used to evaluate the corrosion inhibition of benzotriazole on copper coatings.

In this study we present the results of electroless deposition of silver (Ag) and electrophoretic deposition (EPD) of Al2O3 layers on glass for application in thin film transistor (TFT). Since Ag exhibits excellent resistivity, it is selected to be the material of conductive layer. Ag thin film electrical and physical parameters are studied as a function of the deposition time and working temperature. We study the thin-film electrical and mechanical properties using 4-point Probe, surface analyzer and nano indenter. The Ag film, thicker than 200 nm, exhibited a specific electrical sheet resistivity of about 500 m£[/¡¼. We also study the thin-film morphology and composition using SEM and FTIR, respectively. In this study, Mechanism and kinetics of the electrophoretic process in an Al2O3 cell are also studied. Al2O3 concentration levels are set from 1.25 to 7.5%, and deposition time from 5~20 seconds. Deposition time and Al2O3 particle concentration is experimentally discussed and characterized. The result shows that a linear relationship between the deposition rate and applied voltage is obtained. Besides, in this study, deposition of conductive layer silver and insulating layer Al2O3 for TFT are studied. A new process to deposit Ag layer and Al2O3 layer to be the conductivity layer and insulating layer of TFT is presented. First, the circuit pattern is defined by lithography process. Then, Ag is deposited with thickness of 200 nanometers. Second, the wafer is immersed in the stripper solution to remove the resist. After the deposition of the Ag on glass is finished, Al2O3 nano-scale particle concentration is prepared for electrophoretic deposition.

Thesis (Ph. D.)--University of Texas at Austin, 2002. / Vita. Includes bibliographical references (leaves 163-173). Available also in a digital version from Dissertation Abstracts.