In this thesis, we will investigate the degradation of the Low-Temperature-Polycrystalline-Silicon TFTs(LTPS TFTS) under the electrical stress. The devices are offer by Chi Mei Optoelectronics. The two mechanisms of the electrical stress are ac and dc stress. On the dc stress, we can separate the two degradation mechanisms from fixed drain voltage and various the gate voltage. The first mechanism is hot carrier effect, and second is self-heating effect. We were study the degradation mechanisms cause by above-mentioned phenomenon. On the other hand, we were confirmed the position and type of the defects by measured capacitance. In the ac stress, device degradation depends on the emission rate and energy of the hot carrier. We will study the degradation mechanism which fixed the drain voltage and various the Vg_low and falling time under different temperature. Another way of the ac stress condition will be used here. The drain and source are directly connected to ground. The gate is directly connected to the pulse. At this stress condition, carrier will push to the junction near the drain and source when gate pulse is switch from high to low. This degradation mechanism is the function of the temperature. We are going to employ a C-V measurement to examination of the defect cause by stress.

In this thesis, we study the electrical characteristics of a series of polysilicon thin-film transistors (poly-Si TFTs) with different numbers of multiple channels of various widths, with lightly-doped drain (LDD) structures. Among all investigated TFTs, the nano-scale TFT with ten 67 nm-wide split channels (M10) has superior and more uniform electrical characteristics than other TFTs, such as a higher ON/OFF current ratio (>109), a steeper subthreshold slope (SS) of 137 mV/decade, an absence of drain-induced barrier lowering (DIBL) and a suppressed kink-effect. These results originate from the fact that the active channels of M10 TFT has best gate control due to its nano-wire channels were surrounded by tri-gate electrodes. Additionally, experimental results reveal that the electrical performance of proposed TFTs enhances with the number of channels from one to ten strips of multiple channels sequentially, yielding a profile from a single gate to tri-gate structure. In addition, we have also studied the multi-gate combining the pattern-dependent nickel (Ni) metal-induced lateral crystallization (Ni-MILC) polysilicon thin-film transistors (poly-Si TFTs) with ten nanowire channels. Experimental results reveal that applying ten nanowire channels improves the performance of Ni-MILC poly-Si TFT, which thus has a higher ON current, a lower leakage current and a lower threshold voltage (Vth) than single-channel TFTs. Furthermore, the experimental results reveal that combining the multi-gate structure and ten nanowire channels further enhances the entire performance of Ni-MILC TFTs, which thus have a low leakage current, a high ON/OFF ratio, a low Vth, a steep subthreshold swing (SS) and kink-free output characteristics. The multi-gate with ten nanowire channels NI-MILC TFTs has few poly-Si grain boundary defects, a low lateral electrical field and a gate channel shortening effect, all of which are associated with such high-performance characteristics. The PDMILC TFTs process is compatible with CMOS technology, and involves no extra mask. Such high performance PDMILC TFTs are thus promising for use in future high-performance poly-Si TFT applications, especially in AMLCD and 3D MOSFET stacked circuits. Otherwise, we have investigated the mechanism of the leakage currents in polysilicon TFT with different temperature and applied biases. Moreover, we have simulated the electric fields in different structure polysilicon TFT to explain the mechanism of the leakage currents. By comparing the leakage currents in different channel structures, the leakage current in nanowire channel structure is higher than that in non-nanowire channel structure. Moreover, the leakage current in multiple gate structure is lower than that in single gate structure. Therefore, these two experimental results are caused by high electric field in the drain-to-gate overlap and drain-to-body depletion region respectively.

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Recently, active matrix flat-panel displays are widely used in consumer electronic products. With increasing popularity of flat-panel displays, market competition becomes more intense and demands for high performance flat-panel displays are increasing. Low-temperature polysilicon (LTPS) with higher mobility, as well as drive current can integrate electric circuit, such as controllers and memory on glass substrate of display to achieve the purpose of system on panel (SOP). Thus, flat-panel displays can be more compact, while reducing reliability issues and lowering production costs. In this dissertation, we studied the nonvolatile memory for system on panel applications and reducing cost of memory by increasing the memory density or reducing the processing steps. Therefore, we proposed several modes of operation in nonvolatile memory. First, we use channel hot-electron (CHE) to inject electrons into the nitride layer that¡¦s above source or drain sides of SONOS thin film transistor (TFT). Thus, we can increase the memory density by storing two-bit state in a memory cell. In this study, the two-bit memory effect is clearly observed for devices with a shorter gate length after CHE programming; however, the two-bit memory effect is absent in devices with a longer gate length. The gate-length-dependent two-bit memory effect is related to the location of injected electrons in the nitride layer. When electrons are injected into the nitride layer above the channel, they can create an additional energy barrier in the channel thus increasing the threshold voltage of the device to perform the programming operations. However, if electrons are injected into the depletion region at the P-N junction between the drain and the channel, the energy barrier induced by electrons is not significant when exchanging the source and drain electrodes to measure the memory status, and the program effect is not as significant. When the channel length is shorten, the built-in potential between the source and the channel can be decreased, the energy barrier caused by programmed electrons can affect electrons in the channel and increase the threshold voltage. Therefore, the two-bit memory effect can be seen in devices with the shorter gate length after CHE programming. Secondly, we stored charges in the body of the thin film transistor to make the conventional thin-film transistors become a non-volatile memory. This method does not need a floating gate or a tunneling oxide in the memory cell; therefore the memory cost can be reduced. In this study, we used trap-assisted band-to-band thermionic field emission enhanced by self-heating in TFT to produce electron-hole pairs. The hole will be separated by a vertical field under the gate and be injected into the body of TFT to complete the programming operation. The erasing operation is performed by applying a lateral electric field between the source/drain to remove holes in the body of TFT. Thirdly, we proposed an edge-FN tunneling method to allow SONOS TFT possess not only a pixel switch but also a two-bit nonvolatile memory function in a display panel, thus causing the memory density to increase. In this study, we used a channel FN tunneling to program the SONOS TFT. Because the electric field in the gate-to-drain overlap region is larger than that in the channel region, it will cause a smoother electron injection into the nitride layer inside of the gate-to-drain overlap region, which also increases the gate-induced drain leakage (GIDL) current. The edge-FN tunneling method is used to erase electrons in the gate-to-drain overlap region, by doing so, the GIDL current has decreased. The memory status at the source/drain side is determined by the corresponding GIDL current of the SONOS TFT. Fourthly, we stored electrons in the nitride layer at source, channel, and drain regions of SONOS TFT to make sure that TFT possess a three-bit memory effect in a unitary cell, which also allows the memory density to increase significantly. In this study, programming and erasing operations in the source/drain region are performed by channel hot-electron injection and edge-FN tunneling method, while that in the channel region are accomplished by channel FN tunneling. The memory status in the source/drain is determined by the corresponding GIDL current, while that in the channel region by threshold voltage of the device The memory density for the device operated by proposed method can be further increased. In addition, if we store a number of N different types of electrons in those three regions mentioned above, there are N3 status can be stored in a memory cell. The memory density can beyond conventional multi-level-cell (MLC) flash memory. Two-bit memory effect per cell in a MLC flash memory can be achieved by storing four quantitative electrons in the floating gate of the memory device. If we store four quantitative electrons in the nitride layer at source, channel, and drain regions of SONOS TFT, we can obtain 64 memory states or 6-bit memory effect in a memory cell. Thus, the proposed concept is promising to storage the messages in a memory cell beyond four-bit.