• Refine Query
  • Source
  • Publication year
  • to
  • Language
  • 1
  • Tagged with
  • 1
  • 1
  • 1
  • 1
  • 1
  • 1
  • 1
  • 1
  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
1

Three-Dimensional Patterning Using Ultraviolet Curable Nanoimprint Lithography.

Mohamed, Khairudin January 2009 (has links)
Although a large number of works on nanoimprint lithography (NIL) techniques have been reported, the the ability for three-dimensional (3-D) patterning using NIL has not been fully addressed in terms of the mold fabrication and imprint processes. Patterning 3-D and multilevel features are important because they eliminate multiple steps and complex interlevel alignments in the nanofabrication process. The 3-D and multilevel mold design and fabrication, and imprint processes have been studied and investigated in this research work. In the UV-NIL technique, a transparent mold with micro/nanostructure patterns on its surface is allowed to be replicated on UV curable polymer without the need of high applied pressure or temperature. UV-NIL has the potential to fabricate micro/nanostructures with high resolution, high reproducibility, low cost, high throughput and is capable of 3-D patterning. This research focuses on two aspects; the development of mold making and imprint processes. In the process of making a master mold, an EBL technique was employed for writing patterns on e-beam resists. PMMA positive resist was used for 2-D patterning and ma-N2403 negative resist from Microresist Technology was used for 3-D patterning. After being developed, the 3-D mold pattern was transferred onto quartz substrate using a single-step reactive ion etching (RIE) technique. A number of challenging issues such as surface charging, electron scattering and proximity effects surfaced during the EBL pattern writing on insulating and transparent molds. A number of new approaches have been developed for suppressing the charging effects in the 2-D and 3-D patterning. Using thin metallic coating on the quartz substrates or on top of the resist, or conductive polymer coating using PEDOT/PSS on top of the resist has demonstrated excellent results in a 2-D structure with a high aspect-ratio of 1:10 and feature sizes down to 60 nm. In 3-D patterning, two approaches have been followed; the critical energy method and/or a top coating of conductive polymer (PEDOT/PSS) layer. Isolated 3-D structures with feature sizes down to 500 nm were successfully fabricated using the first method while by using the second method, dense 3-D structures patterns with feature sizes down to 300 nm, on 400 nm pitch have been demonstrated. In UV-NIL, the surface roughness Rq(rms) should be less than 5 nm, which is important for replicating optical structures and devices. In this work, the RIE process been optimized to yield 2 nm roughness on a patterned quartz surface. This was achieved by optimizing the RIE process pressure of below 6 mTorr. The other part of this thesis is on replication or imprinting of 2-D and 3-D structures. In the process of replicating the master mold profiles, the imprint processes were carried out using a vacuum operated manual imprint tool which was attached to a Mask Aligner UV illumination system. In 2-D imprinting, resist sticking on the vertical side wall was the main issue, especially on high aspect ratio structures. Meanwhile in 3-D imprinting, the imprint results have shown good reproducibility in up to 15 imprint cycles, where the issue of Ormocomp soft/daughter mold cracking after long UV exposure had limited the repetition of the imprint cycles. In this thesis, the 2-D and 3-D resist patterning on insulating substrates using the EBL technique have been demonstrated with the assistance of a number of developed charge suppression methods. Single-step RIE pattern transfer onto quartz substrates with surface roughness below 5nm has been achieved. Replication of 3-D and multilevel structures reliably make the UV-NIL technique suitable for future applications such as surface texturing, optical devices and many other complex structures including MEMS.

Page generated in 0.0524 seconds