An investigation of mixed convection in a rectangular enclosure is presented in which the velocity fields in the enclosure are determined using Particle Image Velocimetry (PIV). Basically, this technique records optical images of flow tracers within a flow field, and determines the velocity field by measuring the displacement of the flow tracers during short time intervals. The components which comprise the PIV system and its operation are described in detail to familiarize the reader with this relatively new technique. The main objective of this investigation is to determine the accuracy and applicability of the PIV technique as a velocity measurement tool. This is accomplished by comparing present experimental velocity results to those obtained by Nurnberg [2] using Laser Doppler Anemometry (LDA). LDA has been proven to be an accurate velocity measurement tool and provides data for evaluating PIV results. A second objective of this research is to use the PIV results to verify a numerical code written by Nurnberg [2] which predicts the velocity fields in the rectangular enclosure. However, the comparison of experimental results of the two measurement techniques revealed that the PIV results were too inaccurate to perform this function. The large amount of error present in this PIV system prompted the recommendation of an improved, more accurate system. Although this improved system is very expensive - approximately $40,000 - it will provide velocity measurements with an accuracy close to that of LDA, at half the cost of an LDA system and with far less time for data acquisition and analysis. / Thesis / Master of Engineering (ME)

In this investigation, a single phase fluid is used to study the coupling between natural convection heat transfer within an enclosure and forced convection through computer covering case to cool the electronic chip. Two working fluids are used (water and air) within a rectangular enclosure and the air flow through the computer case is created by an exhaust fan installed at the back of the computer case. The optimum enclosure size configuration that keeps a maximum temperature of the heat source at a safe temperature level (85°C) is determined. The cooling system is tested for varying values of applied power in the range of 15-40W. The study is based on both numerical models and experimental observations. The numerical work was developed using the commercial software (ANSYS-Icepak) to simulate the flow and temperature fields for the desktop computer and the cooling system. The numerical simulation has the same physical geometry as those used in the experimental investigations. The experimental work was aimed to gather the details for temperature field and use them in the validation of the numerical prediction. The results showed that, the cavity size variations influence both the heat transfer process and the maximum temperature. Furthermore, the experimental results ii compared favourably with those obtained numerically, where the maximum deviation in terms of the maximum system temperature, is within 3.5%. Moreover, it is seen that using water as the working fluid within the enclosure is capable of keeping the maximum temperature under 77°C for a heat source of 40W, which is below the recommended electronic chips temperature of not exceeding 85°C. As a result, the noise and vibration level is reduced. In addition, the proposed cooling system saved about 65% of the CPU fan power.

In this investigation, a single phase fluid is used to study the coupling between natural convection heat transfer within an enclosure and forced convection through computer covering case to cool the electronic chip. Two working fluids are used (water and air) within a rectangular enclosure and the air flow through the computer case is created by an exhaust fan installed at the back of the computer case. The optimum enclosure size configuration that keeps a maximum temperature of the heat source at a safe temperature level (85℃) is determined. The cooling system is tested for varying values of applied power in the range of 15−40𝑊. The study is based on both numerical models and experimental observations. The numerical work was developed using the commercial software (ANSYS-Icepak) to simulate the flow and temperature fields for the desktop computer and the cooling system. The numerical simulation has the same physical geometry as those used in the experimental investigations. The experimental work was aimed to gather the details for temperature field and use them in the validation of the numerical prediction. The results showed that, the cavity size variations influence both the heat transfer process and the maximum temperature. Furthermore, the experimental results ii compared favourably with those obtained numerically, where the maximum deviation in terms of the maximum system temperature, is within 3.5%. Moreover, it is seen that using water as the working fluid within the enclosure is capable of keeping the maximum temperature under 77℃ for a heat source of 40𝑊, which is below the recommended electronic chips temperature of not exceeding 85℃. As a result, the noise and vibration level is reduced. In addition, the proposed cooling system saved about 65% of the CPU fan power.