This thesis contains four parts. In the first part, we investigate the post treatment of low-temperature-deposited high dielectric constant (high-k) thin films to enhance their properties. The high-pressure oxygen (O2 and O2+UV light) is employed to improve the properties of low-temperature-deposited metal oxide dielectric films and interfacial layer. In this study, 13nm HfO2 thin films are deposited by sputtering method at room temperature. Then, the oxygen treatments with a high-pressure of 1500 psi at 150 ¢J are performed to replace the conventional high temperature annealing. According to the XPS analyses, integration area of the absorption peaks of O-Hf and O-Hf-Si bonding energies apparently raise and the quantity of oxygen in deposited thin films also increases from XPS measurement. In addition, the leakage current density of standard HfO2 film after O2 and O2+UV light treatments can be improved from 3.12¡Ñ10-6 A/cm2 to 6.27¡Ñ10-7 and 1.3¡Ñ10-8 A/cm2 at |Vg| = 3 V. The leakage current density is significantly suppressed and the current transport mechanism is transformed from trap-assisted tunneling to Schottky-Richardson emission due to the passivation of traps inside HfO2 film and interfacial layer. The proposed treatment is applicable for the future flexible electronics. In the second part of this thesis, we study the memory characteristics of CoSi2 nanocrystals with SiO2 or Al2O3/HfO2 multiple layer tunnel oxide. Due to the property of high-k, it can provide thicker physics thickness than thermal oxide (SiO2) under identical equivalent oxide thickness (EOT) and enhances the reliability without reducing the programming speed. By engineering the different dielectric constant materials and the energy band structure, the performance of nonvolatile memory can be improved. The device that employs HfO2/Al2O3/HfO2 as tunnel oxide exhibits better memory window and carrier injection efficiency than the device employing thermal oxide. Furthermore, the device employs Al2O3/HfO2/Al2O3 as tunnel oxide present the better retention characteristics than the device employs HfO2/Al2O3/HfO2 as tunnel oxide. The corresponding mechanisms were also discussed. For the advanced nonvolatile application, high-k material - hafnium oxide was applied on the resistance switching nonvolatile memory device as resistive switching layer with TiN/Ti/HfO2/TiN structure in the third part of this thesis. By using a thin Ti layer as the reactive buffer layer into the anode side, the proposed device exhibits superior bistable characteristics. Since the Ti can easily absorb oxygen atoms from buried HfO2, the TiN/Ti bi-layer can greatly improve the resistive switching characteristics. The mechanism of the proposed device is dominated by the redox reaction between the Hf and HfOX. In addition, the proposed device has multi-bit storage ability to enhance the storage density. From the temperature-dependent measurements, the low ambient temperatures would cause the formation and rupture of the conduction path with discordant quality and quantity during every switching cycle, which give rise to a wide distribution of the HRS and LRS resistance and instability of resistive switching properties. In the fourth part of this thesis, we investigate the characteristics of an advanced Cu-induced resistance switching non-volatile memory with Pt/Cu/SiON/TiN/SiO2/Si structure. By inserting a Cu ultra thin film between the SiON layer and Pt top electrode, the device exhibits bipolar resistive switching characteristics after a forming process at 13.6 V. However, the forming and resistive switching process can not be observed in the device if the Cu thin film is omitted. Additionally, we employ a two-step forming process to reduce the forming voltage to 7.5 V. During the forming process, the bias-induced Cu could form a filament-like stretched electrode, but the ¡§set¡¨ and ¡§forming¡¨ voltage of the proposed device take place on different polarity. Therefore, we suppose a bipolar switching mechanism, and our device is dominated by the formation and rupture of the oxygen vacancies in a conduction path between the Cu filament and TiN button electrode. The device also demonstrates stable resistance states during 105 cycling bias pulse operations and acceptable retention characteristics after an endurance test at 85¢J. The I-V switching curves are analyzed to realize the carrier transport mechanisms in different bias regions and resistance states. Additionally, the effective thickness of the resistance switching layers (deff) for the samples with different SiON thickness is also extracted from the related mechanism and demonstrated that the deff is independent with the initial SiON thickness. The corresponding mechanisms and the deff verify the bipolar switching is dominated by the formation and rupture of the oxygen vacancies in conduction path between Cu filament and TiN bottom electrode.