Recently, there are great demands for RF band pass filters with smaller size/volume, lighter weight, and higher performance for advanced mobile/wireless communication system. However, fabricated RF filters using traditional lumped element, dielectric resonators, or surface acoustic wave¡]SAW¡^filters have difficulties in on-chip integration, power handling capability, and temperature compensation. Alternatively, thin-film bulk acoustic wave resonator¡]FBAR¡^filters are very suitable devices for MMIC¡¦s since they can be fabricated on Si or GaAs substrates at a lower magnitude than lumped elements or dielectric resonators, plus they have a much lower insertion loss and higher power handling capabilities than surface acoustic wave devices and full integration with other CMOS RF IC circuitry for realizing a goal of system on chip¡]SOC¡^. In their simplest form, practical FBARs consist of a sputtered piezoelectric thin film sandwiched between top and bottom electrodes onto which an electric field is then applied. An FBAR must have two acoustically reflecting surfaces in order to trap energy and produce resonating characteristics. For this purpose, the thin film bulk acoustic resonator has to be isolated acoustically from the substrate. In view of this, in order to obtain a high Q factor and reduce spurious responses, this paper proposed the air gap type resonator using the sacrificial layer etching. The thickness of the AlN thin film used for piezoelectric thin film of Air-gap FBAR is 1um. Pt/Ti with 3000Å/300Å thickness is used as the top and bottom electrode. The device has a resonance frequency of 1.2GHz, and S11-paparameter of -25dB is also obtained.