3D silicon pixel detectors are a novel technology where the electrodes penetrate the sili- con bulk perpendicularly to the wafer surface. As a consequence the collection distance is decoupled from the wafer thickness resulting in a radiation hard pixel detector by design. Between 2010 and 2012, 3D silicon pixel detectors have undergone an intensive programme of beam test experiments. As a result, 3D silicon has successfully qualified for the ATLAS upgrade project, the Insertable B-Layer (IBL), which will be installed in the long-shutdown in 2013-14. This thesis presents selected results from these beam test studies with 3D sensors bonded to both current ATLAS readout cards (FE-I3) and newly developed readout cards for the IBL (FE-I4). 3D devices were studied using 4 GeV positrons at DESY and 120 GeV pions at the SPS at CERN. Measurements presented include tracking efficiency (of the whole sensor, the pixel and the area around the electrodes), studies of the active edge pixels of SINTEF devices and cluster size distributions as a function of incident angle for IBL 3D design sensors. A simulation of 3D silicon sensors in an antiproton beam test for the AEgIS experiment, with comparison to experimental results and a previous simulation, are also presented.

<p>The high luminosity phase of the LHC, poised to start taking data in 2027, aims to increase the instantaneous luminosity of the machine to 7.5 x 10³⁴ cm^-2 s^-1. This will make it possible for experiments at CERN to make higher precision measurements on known physics phenomenon as well as to search for “new physics”. However, this motivates the need for hardware upgrades at the various experiments in order to ensure compatibility with the HL-LHC. This thesis describes some of the efforts to upgrade the inner-most layers of the Compact Muon Solenoid, namely the CMS silicon pixel tracking detector. </p> <p>Silicon sensors used to track particles are installed in the detector as part of a pixel sensor module. Modules consist of a silicon sensor-readout chip assembly that is wire-bonded to an HDI, or High Density Interconnects to provide power and signals. </p> <p>As part of the upgrade, 2,541 modules need to be assembled delicately and identically with alignment error margins as low as 10 microns. Assembly will be across three production sites in clean rooms to avoid dust and humidity contamination.</p> <p>In addition, the modules need to survive high magnetic fields and extended close-range radiation as part of the HL-LHC.</p> <p>In line with this effort, new materials and assembly procedures able to sustain such damage are investigated. Techniques to assemble modules are explored, specifically precision placing of parts with a robotic gantry and techniques to protect wirebonds. This is followed by a discussion of the accuracy and repeatability.</p>

Prévue pour 2024, une série d’améliorations doit être apportée au grand collisionneur d’hadrons du CERN (LHC) de manière à élargir son potentiel de découverte de nouvelle physique. Cette thèse se situe dans la perspective des études d’amélioration du détecteur ATLAS dans ce nouvel environnement, et concerne une nouvelle technologie monolithique HV/HR CMOS qui pourrait être utilisée pour les détecteurs de traces centraux pixélisés. Cette technologie a le potentiel de permettre la réduction de l’épaisseur des détecteurs, d'augmenter la granularité ainsi que de réduire les couts de production.Au sein de la collaboration HV/HR CMOS d’ATLAS, divers prototypes ont été développés en utilisant les technologies de différents partenaires industriels : GlobalFoundries (GF) BCDlite 130 nm et LFoundry (LF) 150 nm entre autres. Pour comprendre le comportement électrique et la capacité de détection de telles technologies, des simulations TCAD -Technology Computer Aided Design- en 2D et 3D ont été réalisées pour extraire le profil de la zone déplétée, la tension de claquage, la capacitance ainsi que la collection de charges ionisées des prototypes. Le développement de systèmes de test complexes et la caractérisation des prototypes HV/HR CMOS ont aussi été une partie du travail fourni pour cette thèse. Les programmes d’acquisition, en particulier pour ce qui concerne les tests sous protons ou auprès d’irradiateurs à rayons X, ainsi que les programmes de réglages de seuil ont été implémenté dans divers systèmes de test. Plusieurs versions des prototypes développés dans 3 technologies HV/HR CMOS différentes (AMS 0.18 μm HV, GF BCDlite 130nm et LF 150nm) ont été caractérisées. / A major upgrade to the Large Hadron Collider (LHC), scheduled for 2024 will be brought to the machine so as to extend its discovery potential. This PhD is part of the ATLAS program and aims at studying a new monolithic technology in the framework of the design of an upgraded ATLAS inner tracker. This new type of sensor is based on a HV/HR CMOS technology, which would potentially offer lower material budget, reduced pixel pitch and lower cost with respect to the traditional hybrid pixel detector concept.Various prototypes have been developed using different HV/HR CMOS technologies from several industrial partners, within the ATLAS HV/HR collaboration, for instance Global Foundry (GF) BCDlite 130 nm and LFoundry (LF) 150 nm. In order to understand the electric behavior and the detection capabilities of these technologies, 3D and 2D Technology Computer Aided Design (TCAD) simulations have been performed to extract the depletion zone profile, the breakdown voltage, the leakage current, the capacitance as well as the charge collection of the prototypes. Test setup developments and characterizations of the HV/HR CMOS prototypes were also part of this thesis. The data acquisition programs, in particular dedicated to the proton test beams, X-ray sources and threshold tuning, have been implemented into various test setups. Several HV/HR CMOS prototypes developed in three HV/HR technologies, AMS 0.18 µm HV, GF BCDlite 130 nm and LF 150 nm, have been characterized.