NDLTD Global ETD Search
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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.

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Showing 21 to 30 of 225 (0.065 seconds)

Spelling suggestions: "subject:"solder)""

21

Fundamental understanding of electrically conductive adhesives (ECA's)

Lu, Daoqiang 08 1900 (has links)
No description available.
Electric conductivity
Adhesives
Packaging
Soldering
22

An evaluation of solder joints of palladium-based alloys produced by infrared energy

Diaz-Siohl, Jesus Alfredo. January 1988 (has links)
Thesis (M.S.)--University of Michigan, Ann Arbor, 1988. / Typescript (photocopy). Includes bibliographical references (leaves 145-149). Also issued in print.
23

An evaluation of solder joints of palladium-based alloys produced by infrared energy

Diaz-Siohl, Jesus Alfredo. January 1988 (has links)
Thesis (M.S.)--University of Michigan, Ann Arbor, 1988. / Typescript (photocopy). eContent provider-neutral record in process. Description based on print version record. Includes bibliographical references (leaves 145-149).
24

Development of microelectronics solder joint Inspection system modal analysis, finite element modeling, and ultrasound signal processing /

Zhang, Lizheng. January 2006 (has links)
Thesis (Ph. D.)--Mechanical Engineering, Georgia Institute of Technology, 2007. / Ume, Charles, Committee Chair ; Book, Wayne, Committee Member ; Michaels, Jennifer, Committee Member ; Sitaraman, Suresh, Committee Member ; Tsui, Kwok-Leung, Committee Member ; Goyal, Deepak, Committee Member.
25

Microstructural evolution of eutectic Au-Sn solder joints

Song, Hogeon. January 2002 (has links) (PDF)
Thesis (Ph.D.)--University of California, Berkeley, 2002. / Chair: John W. Morris, Jr. Includes bibliographical references.
26

Thermodynamics and kinetics of oxidation and temperature dependent mechanical characterization of pure indium solder

Schoeller, Harry E. January 2007 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Department of Mechanical Engineering, 2007. / Includes bibliographical references (leaves 121-122).
27

Solid state diffusion kinetics of intermetallic compound formation in composite solders

Sees, Jennifer Anne. January 1993 (has links) (PDF)
Thesis (Ph.D.)--University of North Texas, 1993. / Major Professor: James L. Marshall. Includes bibliographical references.
28

Diffusion kinetics and microstructure of eutectic and composite solder/copper joints

Wu, Yujing. January 1994 (has links) (PDF)
Thesis (Ph.D.)--University of North Texas, 1994. / Includes bibliographical references.
29

Evaluation, optimization, and reliability of no-flow underfill process

Colella, Michael. January 2004 (has links) (PDF)
Thesis (M.S.)--Mechanical Engineering, Georgia Institute of Technology, 2004. / Daniel Baldwin, Committee Chair; Suresh Sitaraman, Committee Member; Steven Danyluk, Committee Member. Includes bibliographical references (leaves 238-241).
30

Implementation and qualification of a prototype tester for reflow soldering process compatability evaluation of surface mount technology components

Wong, Anthony Yin-bong. January 2002 (has links)
Thesis (Ph. D.)--University of Texas at Austin, 2002. / Vita. Includes bibliographical references. Available also from UMI Company.

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