Thesis (Ph. D.)--State University of New York at Binghamton, Systems Science Dept., 2006. / Includes bibliographical references.

Report (M.S.)--Virginia Polytechnic Institute and State University. M.S. 1993. / Vita. Abstract. Includes bibliographical references (leaves 66-67). Also available via the Internet.

Thesis (M.S.)--State University of New York at Binghamton, Industrial and Systems Engineering Dept., 2007. / Includes bibliographical references.

The thermocyclic fatigue behavior of the low-melting solder 43Sn/43Pb/14Bi has been investigated and compared to that of standard 60Sn/4OPb solder via metallographic analysis (using scanning electron microscopy) and evaluation of the degree of fatigue development (using a fatigue scale as a function of thermocycles). Specimens were subjected to shearing strains imposed by several hundred fatigue thermocycles. Both solder types fatigue by the same microstructural failure mechanism as described by other workers. The mechanism is characterized by a preferential coarsening of the solder joint microstructure at the region of maximum stress concentration where cracks originate.

No description available.

The explosion of SMT and highly-density packages has resulted in more complex and higher density board designs in order to incorporate more features into products while reducing overall package size. This has, in tum, created major challenges for the surface mount manufacturing process, particularly in solder screen printing, component placement, and reflow soldering. Investigation into these areas will contribute to our understanding of the origin of post reflow defects in surface mount assembly and improvement in product quality. The thesis particularly explores empirically the relationship between screen printed paste deposit, the final joint geometry and the fluxing behaviour within the reflowing solder. The thesis also demonstrates the effect of modified screen printing parameters and the lead geometry.

In the fiber-optic modules packaging, the passive alignment can provide mass production, but it also results in low Electro-Optic performance. After using active alignment in packaging, the laser welding is often applied to assemble the module. However, the welding process cause a post-weld-shift (PWS) of fiber. And the laser welding machine is expensive, this will make the module packaging price hard to cost down. A major cost-reduction soldering fixing technique is developed to replace the laser welding. To determine the fabrication tolerances associated with the coupling of a laser diode and a single-mode fiber(SMF), the sensitivity of the coupling efficiency in both linear and angular offsets was measured. In this research, a fiber holder and a gripper have been developed for assembly. And active alignment is used to align the laser diode and SMF under computer control, whereupon a soldering fixing operation joins the fiber holder on the module. During the soldering process, the condition control was provided to keep the deflection steady. After the displacement compensating before soldering, the final displacement is less than 1 ㎛ which keeps the coupling loss within 3dB.

ABSTRACT A DIP (dual-in-line) laser diode module packaging by soldering technique was investigated. We made high coupling efficiency fiber lens under the best arc fusing conditions. The coupling efficiency of fiber lens was obtained 82%, while offset of fiber lens center was less than 0.5mm and curvature radius was about 9mm. We metallized the high coupling efficiency fiber lens, and packaged it in the DIP housing. The components inside the module were uncoated FP (Fabry-Perot) laser chip, p-i-n detector, substrate, and cooler. We made a package process as follows: 1) We utilized the heating apparatus to fix the FP laser, PIN detector, and thermistor on the substrate. 2) We utilized the heating apparatus to make the cooler fixed on the DIP housing and the substrate fixed on the cooler. 3) We utilized the electrothermal heating machine to melt 1.5mm3 indium wire and adjusted the fiber lens by tweezer to couple light into the fiber inside the DIP housing. We obtained the 2.93mW output power and 58.6% coupling efficiency after packaging. The post-soldering-shift resulted from the indium solidification was the most important factor affecting the coupling efficiency. By improving substrate design properly, we could reduce the indium quantity to minimize the solidification effect. The post-soldering-shift should be controlled below 1mm in the transverse axis and below 10 mm in the longitudinal axis, respectively. Finally, We achieved an external cavity fiber grating laser module with 2mW output power, and got an open eye pattern after measuring the DIP transmitter module.

No description available.

Thesis (M.S. in Mechanical Engineering)--Naval Postgraduate School, June 2002. / Thesis advisor(s): Indranath Dutta. Includes bibliographical references (p. 37-38). Also available online.