Chip seals are a commonly used surface treatment used to decrease the deterioration rate of pavement surfaces. Chip seals typically consist of an application of emulsion and cover aggregate. Failure can be driven by improper strength development and inadequate bonding over time. Additionally, chip seal service life varies and long term performance prediction models are not well established. This study has two primary goals. The first goal is to investigate aggregate retention characteristics of chip seal specimens, while investigating material compatibility by means of the Sweep-M test. The second goal is to begin developing a long term performance (LTP) test to represent cores obtained from full-scale chip seal projects. Conditioning and testing protocols for LTP specimens are evaluated for representative chip seal behavior over long periods. Results confirm material interaction and favor the incorporation of sweep testing for optimum performance. Future testing is recommended for in-depth, LTP test protocol evaluation.