No description available.

Master of Science / This thesis presents an in-depth investigation into the thermal design and optimization of Planar magnetics. With system engineering approach, starting from a two stage DC/DC converter, and further extended to other types of resonant converters with planar core. The study aims to address the thermal challenges associated with these converters, including heat generation, temperature limitations, and cooling solutions, to improve their performance and reliability.

When designing a computer system, benchmark programs are used with cycle accurate performance/power simulators and HDL level simulators to evaluate novel architectural enhancements, perform design space exploration, understand the worst-case power characteristics of various designs and find performance bottlenecks. This research effort is directed towards automatically generating synthetic benchmarks to tackle three design challenges: 1) For most of the simulation related purposes, full runs of modern real world parallel applications like the PARSEC, SPLASH suites cannot be used as they take machine weeks of time on cycle accurate and HDL level simulators incurring a prohibitively large time cost 2) The second design challenge is that, some of these real world applications are intellectual property and cannot be shared with processor vendors for design studies 3) The most significant problem in the design stage is the complexity involved in fixing the maximum power consumption of a multicore design, called the Thermal Design Power (TDP). In an effort towards fixing this maximum power consumption of a system at the most optimal point, designers are used to hand-crafting possible code snippets called power viruses. But, this process of trying to manually write such maximum power consuming code snippets is very tedious. All of these aforementioned challenges has lead to the resurrection of synthetic benchmarks in the recent past, serving as a promising solution to all the challenges. During the design stage of a multicore system, availability of a framework to automatically generate system-level synthetic benchmarks for multicore systems will greatly simplify the design process and result in more confident design decisions. The key idea behind such an adaptable benchmark synthesis framework is to identify the key characteristics of real world parallel applications that affect the performance and power consumption of a real program and create synthetic executable programs by varying the values for these characteristics. Firstly, with such a framework, one can generate miniaturized synthetic clones for large target (current and futuristic) parallel applications enabling an architect to use them with slow low-level simulation models (e.g., RTL models in VHDL/Verilog) and helps in tailoring designs to the targeted applications. These synthetic benchmark clones can be distributed to architects and designers even if the original applications are intellectual property, when they are not publicly available. Lastly, such a framework can be used to automatically create maximum power consuming code snippets to be able to help in fixing the TDP, heat sinks, cooling system and other power related features of the system. The workload cloning framework built using the proposed synthetic benchmark generation methodology is evaluated to show its superiority over the existing cloning methodologies for single-core systems by generating miniaturized clones for CPU2006 and ImplantBench workloads with only an average error of 2.9% in performance for up to five orders of magnitude of simulation speedup. The correlation coefficient predicting the sensitivity to design changes is 0.95 and 0.98 for performance and power consumption. The proposed framework is evaluated by cloning parallel applications implemented based on p-threads and OpenMP in the PARSEC benchmark suite. The average error in predicting performance is 4.87% and that of power consumption is 2.73%. The correlation coefficient predicting the sensitivity to design changes is 0.92 for performance. The efficacy of the proposed synthetic benchmark generation framework for power virus generation is evaluation on SPARC, Alpha and x86 ISAs using full system simulators and also using real hardware. The results show that the power viruses generated for single-core systems consume 14-41% more power compared to MPrime on SPARC ISA. Similarly, the power viruses generated for multicore systems consume 45-98%, 40-89% and 41-56% more power than PARSEC workloads, running multiple copies of MPrime and multithreaded SPECjbb respectively. / text

Thermal analysis of buildings was carried out using simplified design tools, prior to the widespread use of computers. Since the early 1980's, the rapid growth of computational power has lead to the introduction of many building dynamic thermal simulation software programs. The accurate performance of many of these programs has lead to the view that manual calculation methods should only be used as indicative design tools. The CIBSE admittance method is based on the fundamentals of building heat transfer, its calculations procedures being simplified for use on hand held calculators. Manual calculation methods must be developed for use on more powerful calculators, if greater accuracy is required. Such calculators are available in the form of computer spreadsheet programs. The computational power of the computer spreadsheet program, combined with suitable mathematical thermal modelling techniques, has thus far, remained unexploited. This thesis describes the development of a powerful manual thermal design method, for application on a computer spreadsheet program. All the modes of building heat transfer are accurately modelled. Free-running or plant-controlled spaces can be simulated. In the case of a single zone, the accuracy of the new manual dynamic thermal model is comparable with commercially available software programs. The level of mathematical modelling complexity is limited only by computer power and user ability. The Iterative Frequency Domain Method (IFDM) and the Adiabatic Iterative Frequency Domain Method (AIFDM) are alternative mathematical simulation techniques developed to form the core of the Thermal Analysis Design Method. In the IFDM and AIFDM, the frequency domain and numerical iteration techniques have been integrated to produce a thermal simulation method that can model all non-linear heat transfer processes. A more accurate formulation of sol-air temperature, a window sol-air temperature and an accurate reduced internal long-wave radiant exchange model is a sample of further innovations in the thesis. Many of the developments described in the thesis, although designed for the computer spreadsheet environment, may also be employed to enhance the performance of some of the current dynamic thermal models of buildings.

Effective application of thermal interface materials (TIM) sandwiched between silicon and a heat spreader in a microelectronic package for improved heat dissipation is studied through thermal and mechanical characterization of high thermally conductive carbon nanotubes (CNTs) integrated into eutectic gallium indium liquid metal (LM) wetting matrix. Thermal conductivity data from Infrared microscopy tool reveals the dependence of experimental factors such as matrix types, TIM contacting interfaces, orientation of CNTs and wetting of CNTs in the matrix on the thermal behavior of TIM composite. Observed generalized trend on LM-CNT TIM shows progressive decrease in effective thermal conductivity with increasing CNT volume fractions. Further thermal characterizations LM-CNT TIM however show over 2x increase in effective thermal conductivity over conventional polymer TIMs (i.e. TIM from silicone oil matrix) but fails to meet 10x improvement expected. Poor wetting of CNT with LM matrix is hypothesized to hinder thermal improvement of LM-CNT TIM composite. Thus, wetting enhancement technique through electro-wetting and liquid crystal (LC) based matrix proposed to enhance CNT-CNT contact in LM-CNT TIM results in thermal conductivity improvement of 40 to 50% with introduction of voltage gradient of 2 to 24 volts on LM-CNT TIM sample with 0.1 to 1 percent CNT volume fractions over non voltage LM-CNT TIM test samples. Key findings through this study show that voltage tests on LC- CNT TIM can cause increased CNT-CNT networks resulting in 5x increase in thermal conductivity over non voltage LC-CNT TIM and over 2x improvement over silicone-CNT TIMs. Validation of LM wetting of CNT hypothesis further shows that wetting and interface adhesion mechanisms are not the only factors required to improve thermal performance of LM-CNT TIM. Anisotropic characteristic of thermal conductivity of randomly dispersed CNTs is a major factor causing lower thermal performance of LM-CNTs TIM composite. Other factors resulting in LM-CNT TIM decreasing thermal conductivity with increasing CNT loading are (i) Lack of CNT-CNT network due to large difference in surface tension and mass density between CNTs and LM in TIM composite (ii) Structural stability of MWCNT and small MFP of phonons in ~5um MWCNTs compared to the system resulted in phonon scattering with reduced heat flow (iii) CNT percolation threshold limit not reached owing to thermal shielding due to CNT tube interfacial thermal resistance. While mixture analytical models employed are able to predict thermal behaviors consistent with CNT-CNT network and CNT- polymer matrix contact phenomenon, these models are not equipped to predict thermo-chemical attributes of CNTs in LM-CNT TIM. Extent of LM-CNT wetting and LM-solid surface interfacial contact impacts on interfacial thermal resistance are investigated through LM contact angle, XPS/AES and SEM-EDX analyses on Au/Ni and Ni coated copper surfaces. Contact angle measurements in the range of 120o at both 55oC and 125oC show non wetting of LM on CNT, Au and Ni surfaces. Interface reactive wetting elemental composition of 21 days aged LM on Au/Ni and Ni surfaces reveals Ga dissolution in Au and Ni diffusion of ~0.32um in Au which are not present for similar analysis of 1 day LM on Au/Ni surface. Formation of Au-Ni-Ga IMC and IMC-oxide iono-covalency occurrence at the interface causes reduction in surface tension and reduction in interfacial contact resistance.

This masters’ thesis deals with a thermal design of a draft dry bottom boiler for bituminous coal that should replace a disassembled boiler in a current boiler room. Application of SCR is intended in order to reach emission standards of NOx.

The aim of this thesis is a draft of a gas steam boiler with steam output of 200 t/h. The first part of the paper provides stoichiometric calculations, then there are calculations of the dew point, boiler efficiency and the amount of gas. After that, calculations and a draft of the combustion chamber are carried out and then heat balances are drafted. In the following text, geometric properties of individual heat exchanging surfaces are drafted. At the end, there are control calculations. This thesis contains a blueprint of the gas steam boiler.

No description available.

This work presents the design and analysis of two Litz wire transformers for a 500 kHz, 18 kW input­parallel output­series partial power processing converter (IPOS PPP). Because the two power paths in the IPOS PPP operate as “dc transformers” (DCX), both transformers are designed with the goal of leakage inductance minimization in order to reduce gain variation around the resonant frequency. The selected winding topology with the lowest leakage inductance results in an impedance mismatch among parallel secondaries used in the majority power path transformer, resulting in poor current sharing. In order to balance the goals of leakage inductance minimization and even current sharing, a new winding technique called “intra­leaving” is presented which reduces current sharing error from 50%, to 5%. A design rule for “intra­leaving” is also established which extends the winding method to different winding configurations and higher numbers of parallel winding. A novel cooling duct designed with computational fluid dynamics is used for transformer thermal management. The cooling duct uses two 30 mm 7.7 CFM fans to cool the transformer winding and achieves a small height of 43 mm and only 6.8 W power consumption. Using the cooling duct, 106 °C peak winding temperature and 76 °C peak core temperature is achieved at 15 kW load, an ∼ 8% reduction compared to using a conventional 120 mm fan 41 CFM fan. The two transformers with the cooling system achieve 635 W/in3 power density, 1U height compliance, and 99.4% peak efficiency. / M.S. / As society moves towards the electric grid of the future, there have been increased calls for the research and development of resonant power converters due to their high efficiency, high power density, and low electromagnetic interference. The high frequency transformer is one of the main components of the resonant converter system as it contributes substantially to the converters volume, power loss, and thermal management risks. This work seeks to address the trade­offs between leakage inductance minimization and transformer current sharing and proposes a winding method called “intra­leaving” which achieves both. Using “intra­leaving” current sharing error was reduced from 50%, to 5%. Operating transformers at high frequency reduces their volume in accordance with Faraday’s law but also increases thermal risks due to decreased core surface area, higher winding fill factor, and higher loss per unit volume. A novel cooling duct designed using computational fluid dynamics is presented using two 30 mm 7.7 CFM fans and achieves a small height of 43 mm and only 6.8 W power consumption. Using the cooling duct, 106 °C peak winding temperature and 76 °C peak core temperature is achieved at 15 kW load, an ∼ 8% reduction compared to using a conventional 120 mm fan 41 CFM fan. The transformers with the cooling system designed in this work achieve 635 W/in³ power density, 1U height compliance, and 99.4% peak efficiency.

This thesis describes the design of a new circuit for the production of superheated steam instead of the original heat exchanger, which showed frequent failure. In the introduction is disassambling the problems of the existing heat exchanger and the proposed method of solving the problem. Proposed is a new process circuit consisting of a heat exchanger to heat the steam, separator and heat exchanger for superheated stream. Gradually, the work both heat exchangers are designed thermal and strenght. In the thermal part is modeled all process circuit and calculated in the program ChemCad. The strength calculation is solved analytically according to EN 13 445, then all dimensions of heat exchangers are optimized. In the conclusion is verified by metod of finite element critical part of the exchanger. After successful completion of the design thermal and strength calculation was made relevant drawing documentation.