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Evaluation and process development of wafer-level-applied underfill material systems for flip chip assemblyBusch, Stephen Christopher 05 1900 (has links)
No description available.
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A thermal analysis tool for three-dimensional models of multilayer microelectronics /Creel, Kenneth E., January 1994 (has links)
Thesis (M.S.)--Virginia Polytechnic Institute and State University, 1994. / Vita. Abstract. Includes bibliographical references (leaf 128). Also available via the Internet.
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Materials study for interfacial adhesion and reliability of microelectronics packaging structures /Dai, Xiang, January 1998 (has links)
Thesis (Ph. D.)--University of Texas at Austin, 1998. / Vita. Includes bibliographical references (leaves 154-163). Available also in a digital version from Dissertation Abstracts.
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Thermo-mechanical behavior of tin-lead and lead-free ceramic column grid array packagesJoshi, Rahul V. January 2005 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Mechanical Engineering Dept., 2005. / Includes bibliographical references.
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Hybrid spectral/intelligent modeling, control and diagnosis for nonlinear distributed curing processes /Deng, Hua. January 2005 (has links) (PDF)
Thesis (Ph. D.)--City University of Hong Kong, 2005. / "Submitted to Department of Manufacturing Engineering and Engineering Management in partial fulfillment of the requirements for the degree of Doctor of Philosophy." Includes bibliographical references (leaves 169-181).
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Flip chip assembly process development, process characterization, and reliability assessment of polymer stud grid array-chip scaled packagePaydenkar, Chetan S. 05 1900 (has links)
No description available.
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Cure behavior of epoxy polymers used in microelectronics /Taweeplengsangsuke, Jantrawan, January 2000 (has links)
Thesis (Ph. D.)--Lehigh University, 2000. / Includes vita. Includes bibliographical references (leaves 220-231).
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Palletization and design-of-simulations for large area processing and assembly in electronic packagingVariyam, Manjula N. 08 1900 (has links)
No description available.
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High density, high aspect ratio through-wafer electrical interconnect vias for MEMS packagingOk, Seong Joon 12 1900 (has links)
No description available.
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Development and integration of thin film zinc oxide integral resistors in SOPMorales, Hector Roberto 05 1900 (has links)
No description available.
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