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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.

Search results

Showing 41 to 50 of 140 (0.064 seconds)

Spelling suggestions: "subject:"microelectronic packaging"" "subject:"microelectronic ackaging""

41

Physics-based modeling methodology for reliability of microvias

Ramakrishna, Gnyaneshwar 08 1900 (has links)
No description available.
Microelectronic packaging Materials
42

Development and integration of thin film polymer ceramic nanocomposite capacitor dielectrics in SOP

Windlass, Hitesh 12 1900 (has links)
No description available.
Microelectronic packaging
Nanostructure materials
Nanotechnology
Composite materials
43

Establishment of an analytical and experimental test facility for the evaluation of thermal management in microelectric packages

Campbell, James Stephen, Jr. 05 1900 (has links)
No description available.
Microelectronic packaging Testing
Microelectronics
Thermal stresses
44

Flip chip processing of lead-free solders and halogen-free high density microvia substrates

Baynham, Grant Andrew 05 1900 (has links)
No description available.
Microelectronic packaging Materials
Solder and soldering
Green technology
45

Processing and characterization of polymer-ceramic composite thin film dielectrics for embedded decoupling applications

Mani, Rajesh 12 1900 (has links)
No description available.
Microelectronic packaging
Composite materials
Thin films
Capacitors
46

Thermal management of small scale electronic systems

Desai, Anand Hasmukh. January 2006 (has links)
Thesis (Ph. D.)--State University of New York at Binghamton, Department of Mechanical Engineering, 2006. / Includes bibliographical references (leaves 163-164).
47

Numerical prediction and experimental validation of flip chip solder joint geometry for MEMS applications /

Lo, Chi Chuen. January 2008 (has links)
Thesis (Ph.D.)--Hong Kong University of Science and Technology, 2008. / Includes bibliographical references (leaves 149-158). Also available in electronic version.
48

Capacity requirements planning of multichip modules through simulation

Dasalla, Kathryn Anne. January 2007 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references.
49

Computational and experimental investigations of laser drilling and welding for microelectronic packaging

Han, Wei. January 2004 (has links)
Thesis (Ph. D.)--Worcester Polytechnic Institute. / Keywords: Optoelectronic holography; Microwelding; Microelectronic packaging; Microdrilling; Laser micromachining; Computational modeling. Includes bibliographical references (p. 204-212).
50

Study and characterization of plastic encapsulated packages for MEMS

Deshpande, Anjali W. January 2005 (has links)
Thesis (M.S.)--Worcester Polytechnic Institute. / Keywords: finite difference methods; OEH methodology; packaging; plastic encapsulation; Fick's second law of diffusion; MEMS. Includes bibliographical references (p. 144-161).

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