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Reliability Improvement for Lead Free UltraCSPLiu, Chin-chiang 12 February 2004 (has links)
1.Sn/Ag4.0/Cu0.5 solder with better performance by the improved reflow profile.
2.The Sn/Ag2.6/Cu0.6¡BSn/Ag4.0/Cu0.5 with similar reliability test performance.
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