Thesis (Ph. D.)--University of Texas at Austin, 2004. / Supervisor: Michael D. Bryant. Vita. Includes bibliographical references.

The development of wireless communications increases the challenges on antenna performance to improve the capability of the whole system. New fabrication technologies are emerging that not only can improve the performance of components but also provide more options for materials and geometries. One of the advanced technologies, referred to as deep X-ray lithography (XRL), can improve the performance of RF components while providing interesting opportunities for fabrication. Since this fabrication technology enables the objects of high aspect ratio (tall) structure with high accuracy, it offers RF/microwave components some unique advantages, such as higher coupling energy and compacted size. The research presented in that thesis investigates the properties of deep XRL fabricated tall microstrip transmission line and describes some important features such as characteristic impedance, attenuation, and electromagnetic field distribution. Furthermore, since most of traditional feeding structure cannot supply enough coupling energy to excite the low permittivity DRA element (εr≤10), three novel feeding schemes composed by tall microstrip line on exciting dielectric resonator antennas (DRA) with low permittivity are proposed and analyzed in this research. Both simulation and experimental measured results exhibit excellent performance. Additionally, a new simulation approach to realize Dolph-Chebyshev linear series-fed DRA arrays by using the advantages of tall microstrip line feeding structure is proposed. By using a novel T shape feeding scheme, the array exhibits wide band operation due to the low permittivity (εr=5) DRA elements and good radiation pattern due to the novel feeding structure. The tall metal transmission line feed structure and the polymer-based DRA elements could be fabricated in a common process by the deep XRL technology. This thesis firstly illustrates properties and knowledge for both DRA element and the tall transmission line. Then the three novel feeding schemes by using the tall transmission line on exciting the low permittivity DRA are proposed and one of the feeding structures, side coupling feeding, is analyzed through the simulation and experiments. Finally, the T shape feeding structure is applied into low permittivity linear DRA array design work. A novel method on designing the Dolph-Chebyshev array is proposed making the design work more efficient.

Microelectromechanical systems (MEMS) devices have been increasing in popularity for radio frequency (RF) and microwave communication systems due to the ability of MEMS devices to improve the performance of these circuits and systems. This interdisciplinary field combines the aspects of lithographic fabrication, mechanics, materials science, and RF/microwave circuit technology to produce moving structures with feature dimensions on the micron scale (micro-structures). MEMS technology has been used to improve switches, varactors, and inductors to name a few specific examples. Most MEMS devices have been fabricated using planar micro fabrication techniques that are similar to current integrated circuit (IC) fabrication techniques. These techniques limit the thickness of individual layers to a few microns, and restrict the structures to have planar and not vertical features. One micro fabrication technology that has not seen much application to microwave MEMS devices is LIGA, a German acronym for X-ray lithography, electroforming, and moulding. LIGA uses X-ray lithography to produce very tall structures (hundreds of microns) with excellent structural quality, and with lateral feature sizes smaller than a micron. These unique properties have led to an increased interest in LIGA for the development of high performance microwave devices, particularly as operating frequencies increase and physical device size decreases. Existing work using LIGA for microwave devices has concentrated on statically operating structures such as transmission lines, filters, couplers, and antennas. This research uses these unique fabrication capabilities to develop dynamically operating microwave devices with high frequency performance. This thesis documents the design, fabrication and testing of LIGA-MEMS variable capacitors that exploit the vertical dimension. Also included are methods to improve both the reliable fabrication and operation of these devices as well as material property characterization. Variable capacitors can be found in systems such as voltage-controlled oscillators, filters, impedance matching networks and phase shifters. Important figures-of-merit for these devices include the quality factor (Q), tuning range and tuning voltage. Two different types of variable capacitors are presented, a pull-away design and a design based on the principle of leveraged bending. The pull-away style variable capacitors were found to have high Q-factors, especially the devices fabricated using a thick gold device layer. As an example, the small gold half capacitance electrode design features a Q-factor of 95 at an operating frequency of 5.6 GHz and a tuning ratio of 1.36:1 with a tuning voltage range of 0 to 7.8 V. The design based on leveraged bending significantly improves the tuning ratio to a value of 1.9:1 while still maintaining a high Q-factor similar to those found in the pull-away style designs. A further increase in tuning ratio to a value of approximately 2.7:1 would be possible, based on simulated results, by simply changing the angle of the capacitance electrode in the layout. To improve device performance and fabrication reliability, modifications were made to both the fabrication process and the device layout. In the fabrication process the exposure step, electroplating step, and the etching process were modified to improve the quality of the resulting devices. In the layout, anti-stiction measures were introduced that reduce the contact area during collapse. To improve device characterization as well as the feedback link between simulation and fabrication, a set of test structures called VM-TEST was developed to accurately determine the important mechanical material properties of thick electroplated layers. These structures utilize the measurement of the pull-in voltage in cantilever and fixed-fixed beams, along with measured structure dimensions, to accurately extract the mechanical properties. Both nickel and gold test structures were analyzed with extracted Young’s modulus values of 186.2 and 60.8 GPa respectively. Also presented is a study of the gap shape in cantilever and fixed-fixed beams that significantly reduces the pull-in voltage while still maintaining a required maximum actuator displacement. It was shown that in the case of cantilever beam actuators, an approximately 40% reduction in pull-in voltage is possible, and in the case of fixed-fixed beam actuators, an approximately 30% reduction is possible by simply varying the shape of the gap between the beam and actuator electrode. These results can be used to significantly reduce the pull-in voltage of future designs. These promising results show that the LIGA fabrication process is capable of producing high performance dynamically operating RF MEMS devices, by exploiting the vertical dimension, not typically performed in most existing RF MEMS designs.