We have fabricated a laser array module using a passive self-aligned flip-chip bonding technique. Silicon optical bench was used as a submount with PbSn (Tm=183¢J) solder bump and V-grooves. A 4-channel laser array was flip-chip mounted with coupling efficiency of 56% to cleaved 62.5/125£gm multimode fiber ribbons. The optimum fabrication parameters were bonding time of 20 seconds and bonding load of 10g. The average misalignments were measured to be 1£gm and 5£gm for X and Y directions , respectively.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0112101-132614 |
| Date | 12 January 2001 |
| Creators | Hsieh, Cheng-Han |
| Contributors | Sheng-Lung Huang, Jao-Hwa Kuang, Weng-Jin Wu, Wood-Hi Cheng, Tsong-Sheng Lay, An-Kuo Chu |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0112101-132614 |
| Rights | campus_withheld, Copyright information available at source archive |
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