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Novel Fluorite Structure Ferroelectric and Antiferroelectric Hafnium Oxide-based Nonvolatile Memories

The ferroelectricity in fluorite structure based hafnium oxide (HfO2) material expanded the horizon for realizing nonvolatile ferroelectric memory concepts. Due to the excellent HfO2 ferroelectric film properties, CMOS compatibility, and scalability; the material is foreseen as a replacement of the lead based ferroelectric materials with a big game changing potential for the emerging ferroelectric memories. In this thesis, the development of novel memory concepts based on the ferroelectric or antiferroelectric HfO2 material is reported. The ferroelectric field effect transistor (FeFET) memory concept offers a low power, high-speed, nonvolatile, and one cell memory solution ideal for embedded memory realization. As an emerging concept based on a novel ferroelectric material, the FeFET is challenged with key performance aspects intrinsic to the underlying physics of the device. A central part of this thesis is the development of FeFET through material and gate stack engineering, in turn leading to innovative novel device concepts. The conceptual innovation, process development, and electrical assessment are explored for an ferroelectric or antiferroelectric HfO2 based nonvolatile memories with focus on the underlying device physics. The impact of the ferroelectric material on the FeFET physics is explored via the screening of different HfO2 based ferroelectric materials, thicknesses, and the film doping concentration. The impact of material interfaces and substrate doping conditions are explored on the stack engineering level to achieve a low power and reliable FeFET. The material optimization leads to the concept of ferroelectric lamination, i.e. a dielectric interlayer between multi ferroelectric ones, to achieve a novel multilevel data storage in FeFET at reduced device variability. Toward a low power FeFET, the stack structure tuning and dual ferroelectric layer integration are explored through an MFM and MFIS integration in a single novel FeFET stack. The charge trapping effect during the FeFET switching captures the dynamics of the hysteresis polarization switching inside the stack with direct impact on the interfacial layer field. Even though manifesting as a clear drawback in FeFET operation, it can be utilized in Flash, leading to a novel hybrid low power and high-speed antiferroelectric based charge trap concept. Furthermore, the FeFET reliability is studied covering the role of operating temperature and the ferroelectric wakeup phenomenon observed in the FeFET. The temperature modulated operation, role of the high-temperature pyroelectric effect, and the temperature induced endurance and retention reliability are studied.:Table of Contents

Abstract
Table of Contents
1. Introduction
2. Fundamentals
2.1. Basics of Ferroelectricity
2.2. The FeFET Operation Principle and Gate Stack Theory
2.3. Structure and Outline of the PhD Thesis
3. The Emerging Memory Optimization Cycle: From Conceptual Design to Fabrication
3.1. The FeFET Conceptual Design and Layout Implementation
3.2. Gate First FeFET Fabrication: Material and Gate Stack Optimization
3.3. Novel Gate First based Memory Concepts: Device Integration and Stack Optimization
3.4. Device Characterization: Electrical Testing Schemes
4. The Emerging FeFET Memory: Material and Gate Stack Optimization
4.1. Material Aspect of FeFET Optimization: Role of the FE Material Properties
4.2. The Stack Aspect of FeFET Optimization: Role of the Interface Layer Properties
4.3. The Stack Aspect of FeFET Optimization: Role of the Substrate Implant Doping
4.4. Summary
5. A Novel Multilevel Cell FeFET Memory: Laminated HSO and HZO Ferroelectrics
5.1. The Laminate MFM and Stack Characteristics
5.2. The Laminate based FeFET Memory Switching
5.3. The Laminate FeFET Multilevel Coding Operation (1 bit, 2 bit, 3 bit/cell)
5.4. The Maximum Laminate FeFET MW Dependence on FE Stack Thickness
5.5. The Role of Wakeup and Charge Trapping
5.6. The Laminate MLC FeFET Area Dependence
5.7. The Laminate MLC Retention and Endurance
5.8. Impact of Pass Voltage Disturb on Laminate based NAND Array Operation
5.9. The Laminate FeFET based Synaptic Device
5.10. Summary
6. A Novel Ferroelectric MFMFIS FeFET: Toward Low Power and High-Speed NVM
6.1. The MFMFIS FeFET P-E and FET Characteristics
6.2. The MFMFIS based Memory Characteristics
6.3. The Impact of MFMFIS Stack Structure Tuning
6.4. The Maximum MFMFIS FeFET Memory Window
6.5. The Role of Device Scalability and Variability
6.6. The MFMFIS Area Tuning for Low Power Operation
6.7. The MFMFIS based FeFET Reliability
6.8. The Synaptic MFMFIS based FeFET
6.9. Summary
7. A Novel Hybrid Low Power and High-Speed Antiferroelectric Boosted Charge Trap Memory
7.1. The Hybrid Charge Trap Memory Switching Characteristics
7.2. The Role of Polarization Switching on Optimal Write Conditions
7.3. The Impact of FE/AFE Properties on the Charge Trap Maximum Memory Window
7.4. The Hybrid AFE Charge Trap Multi-level Coding and Array Operation
7.5. The Global Variability and Area Dependence of the Charge Trap Memory Window
7.6. The AFE Charge Trap Reliability
7.7. The Hybrid AFE Charge Trap based Synapse
7.8. Summary
8. The Emerging FeFET Reliability: Role of Operating Temperature and Wakeup Effect
8.1. The FeFET Temperature Reliability: A Temperature Modulated Operation
8.2. The FeFET Temperature Reliability: Role of the Pyroelectric Effect
8.3. The FeFET Temperature Reliability: Endurance and Retention
8.4. The Impact of Ferroelectric Wakeup on the FeFET Memory Reliability
8.5. Summary
9. Closure: What this Thesis has Solved?
9.1. How material selection/development influence the FeFET?
9.2. Why the FeFET Still Operates at High Write Conditions?
9.3. Why the FeFET Endurance is still a Challenge?
9.4. Can the FeFET become Multi-bit Storage Memory?
9.5. How the Scalability Determine FeFET Chances?
10. Summary
11. Bibliography
List of symbols and abbreviations
List of Publications
Acknowledgment
Erklärung

Identiferoai:union.ndltd.org:DRESDEN/oai:qucosa:de:qucosa:78940
Date26 April 2022
CreatorsAli, Tarek
ContributorsEng, Lukas, Van Houdt, Jan, Müller, Johannes, Technische Universität Dresden, Fraunhofer IPMS Center Nanoelectronic Technologies
Source SetsHochschulschriftenserver (HSSS) der SLUB Dresden
LanguageEnglish
Detected LanguageEnglish
Typeinfo:eu-repo/semantics/publishedVersion, doc-type:doctoralThesis, info:eu-repo/semantics/doctoralThesis, doc-type:Text
Rightsinfo:eu-repo/semantics/openAccess

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