Experimental investigation on testing conditions of solder ball shear and pull tests and the correlation with board level mechanical drop test /

Description

Thesis (Ph.D.)--Hong Kong University of Science and Technology, 2007. / Includes bibliographical references (leaves 163-172). Also available in electronic version.

Links & Downloads

1. http://library.ust.hk/cgi/db/thesis.pl?MECH%202007%20SONG

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Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/176919570
Date	January 2007
Creators	Song, Fubin.
Source Sets	OCLC
Language	English
Detected Language	English
Source	View abstract or full-text.