Thesis (M. Phil.)--Hong Kong University of Science and Technology, 2003. / Includes bibliographical references (leaves 103-114). Also available in electronic version. Access restricted to campus users.

Thesis (M.S.)--State University of New York at Binghamton, Watson School of Engineering and Applied Science (Mechanical Engineering), 2007. / Includes bibliographical references.

Thesis (Ph.D.)--Hong Kong University of Science and Technology, 2007. / Includes bibliographical references (leaves 163-172). Also available in electronic version.

ABSTRACT Wireless communication products require thinner and small packaging to allow for reductions in Cell Phone and PDA product sizes. Currently, the Film-BGA (Ball Grid Array) package is in production for thinner and small case. The Film-BGA package is a thin package that uses polyimide tape as a substrate to reduce the overall package profile to 1 mm and ball pitch is 0.5 mm. The Film substrate can reach 0.11 mm thick or less. Analysis the Film-BGA model consists of a sequentially coupled thermal- mechanical analysis considering epoxy curing, post molding compound and IR-Reflow by MARC. After these processes Film-BGA will occur warpage and residual stress, we will study the sizes of materials on the warpage and residual stress by Taguchi Method. From the MARC analysis, it is found that due to the coefficient of thermal expansion (CTE) mismatch between solder ball, die, molding compound, epoxy and substrate, there exists very high stress near the interfaces of epoxy and results the maximum warpage (y-displacement) that occurs at the edge of the substrate after IR-Reflow. By means of the Taguchi Method, it is found that die size greatly affect the warpage of Film-BGA more than epoxy size and molding compound size. It is also found that epoxy size has more effect than die size and molding compound size on the residual stress of Film-BGA.

This study aims to investigate the effect of a 96 I/O Film-BGA package of surface mounted components on the thermal induced nonlinear viscoplastic deformation of solder balls during temperature cyclic loading between -40¢J to 125¢J. Specifically, it aims to study the trend effect of the joint fatigue life with respect to four control factors of the PI (Polyimide) thickness, die size, die thickness, and the upper copper trace thickness. Then, two different package types of Fan-in and Fan-out design in terms of the joint fatigue life are discussed. Due to the structure/loading symmetry, a three-dimension octant finite element structure was modeled to capture the entire package structural behaviors and a formulation of Modified Coffin-Manson was used to predict the joint fatigue life. Under temperature cyclic loading, the study results show that the die size, die thickness, and PI thickness had significant impact on the solder joint fatigue life, especially the effect of applying die size to the joint, but the upper copper trace thickness had little effect on the joint fatigue life. The study results also show that the package type of Fan-out design had higher joint fatigue life than that the package type of Fan-in design did for this Film-BGA package. In addition, by using the Taguchi method, the research could find the intensity of affected fatigue life due to the selected four control factors, and determine the optimized design by means of the optimized dimensions of the control factors. Then, the use of the ANOVA (analysis of variance) method helped the researcher predict the optimized joint fatigue life in comparison with the study results by using ANSYS finite element software analysis.

Thesis--Auburn University, 2009. / Abstract. Vita. Includes bibliographic references (p.80-97).

Thesis (Ph. D.)--Hong Kong University of Science and Technology, 2003. / Includes bibliographical references. Also available in electronic version. Access restricted to campus users.

Thesis (M.S.M.E.)--University of South Florida, 2003. / Title from PDF of title page. Document formatted into pages; contains 87 pages. Includes bibliographical references.

Thesis(M.S.)--Auburn University, 2006. / Abstract. Vita. Includes bibliographic references.

Thesis (M.S.)--State University of New York at Binghamton, Watson School of Engineering and Applied Science (Mechanical Engineering), 2007. / Includes bibliographical references.