Thesis (M. App. Sc.)--Carleton University, 2002. / Includes bibliographical references (p. 206-212). Also available in electronic format on the Internet.

Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references.

Thesis (M.S.)--State University of New York at Binghamton, Department of Systems Science and Industrial Engineering, 2004. / Includes bibliographical references.

Thesis (Ph. D.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Mechanical Engineering, 2008. / Includes bibliographical references.

Rapporten beskriver ett examensarbete som har genomförts hos Scania R&D. Målet har varit att testa om det är möjligt att använda JTAG för kontroll av Ball Grid Array på komponenter som sitter på kretskort. Vanliga mätmetoder kan inte användas med mindre än att man separerar komponenten från kretskortet. Det som framkommer är att JTAG kan användas för att kontrollera Ball Grid Array samtidigt som kretskortet finns i ett så kallat temperaturchockskåp (som används för att testa hur utrustning och komponenter reagerar vid snabba temperaturändringar). Svårigheten består att den flatkabel som för över signaler mellan dator och kretskort är så lång att arrangemanget blir störningskänsligt. Detta kan lösas med en Extender som förstärker signalen så att kabeln kan vara längre än 0,5 meter. Resultat visar att JTAG kan användas med kretskort som befinner sig i temperaturchockskåpet. Målet har även varit att utveckla en kontrollmetod för att kontrollera att det kretskort som levereras till Scania uppfyller kraven i ISO 26262. För att kunna kontrollera om en leverantör uppfyller ISO 26262 behövs dokumentation som verifierar att produkten utvecklats i enlighet med ISO 26262. I ISO standarden finns det tolv delar som beskriver kraven på produkten. I rapporten har fokus lagts på delen som handlar om hårdvara. Ingen kontrollmetod har kunnat utvecklats då ISO standarden var mer omfattade än väntat.

The subject of this dissertation is the development of three-dimensional (3D) surface profilers for semiconductor back-end inspection. The value of this study is: 1) to provide a new phase-to-height relationship for Fourier Transform Profilometry (FTP) that is universal as it allows alternate FTP system architectures for a micrometer scale object measurement, and 2) to provide a new method for full field substrate warpage and ball grid array (BGA) coplanarity inspection using machine vision. The desire to increase electronic device performance has resulted in denser and smaller IC packaging. As the dimensions of the devices decrease, the requirements for substrate flatness and surface quality become critical in avoiding device failure. For a high yield production, there is an increasing demand in the requirement for the dimensional verification of height, which requires 3D inspection. Based on the current demands from the semiconductor industry, this dissertation addresses the development of fast in-line surface profilers for large volume IC package inspection. Specifically, this dissertation studies two noncontact surface profilers. The first profiler is based on FTP for measuring the IC package front surface, the silicon die and the epoxy underfill profile. The second profiler is based on stereovision and it is intended for inspecting the BGA coplanarity and the substrate warpage. A geometrical shape based matching algorithm is also developed for finding point correspondences between IC package images. The FTP profiler provides a 1 σRMS error of about 4 μm for an IC package sample in an area of 14 mm x 6.5 mm with a 0.13 second data acquisition time. For evaluating the performance of the stereovision system, the linearity between our system and a confocal microscope is studied by measuring a particular IC sample with an area of 38 mm x 28.5 mm. The correlation coefficient is 0.965 and the 2σdifference in the two methods is 26.9 μm for the warpage measurement. For BGA coplanarity inspection the correlation coefficient is 0.952 and the 2difference is 31.2 μm. Data acquisition takes about 0.2 seconds for full field measurements.

Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department or Systems Science and Industrial Engineering, 2009. / Includes bibliographical references.

Thesis (M.S.)--State University of New York at Binghamton, Department of Mechanical Engineering, 2005. / Includes bibliographical references (leaves 70-72).

Title from PDF of title page. / Document formatted into pages; contains 87 pages. / Thesis (M.S.M.E.)--University of South Florida, 2003. / Includes bibliographical references. / Text (Electronic thesis) in PDF format. / ABSTRACT: As technology progresses towards smaller electronic packages, thermo-mechanical considerations pose a challenge to package designers. One area of difficulty is the ability to predict the fatigue life of the solder connections. To do this one must be able to accurately model the thermo-mechanical performance of the electronic package. As the solder ball size decreases, it becomes difficult to determine the performance of the package with traditional methods such as the use of strain gages. This is due to the fact that strain gages become limited in size and resolution and lack the ability to measure discreet strain fields as the solder ball size decreases. A solution to the limitations exhibited in strain gages is the use of Moiré interferometry. Moiré interferometry utilizes optical interferometry to measure small, in-plane relative displacements and strains with high sensitivity. / ABSTRACT: Moiré interferometry is a full field technique over the application area, whereas a strain gage gives an average strain for the area encompassed by the gage. This ability to measure full field strains is useful in the analysis of electronic package interconnections; especially when used to measure strains in the solder ball corners, where failure is known to originate. While the improved resolution of the data yielded by the method of Moiré interferometry results in the ability to develop more accurate models, that is not to say the process is simple and without difficulties of it's own. Moiré interferometry is inherently susceptible to error due to experimental and environmental effects; therefore, it is vital to generate a reliable experimental procedure that provides repeatable results. This was achieved in this study by emulating and modifying established procedures to meet our specific application. / ABSTRACT: The developed procedure includes the preparation of the specimen, the replication and transfer of the grids, the use of the PEMI, interpretation of results, and validation of data by finite element analysis using ANSYS software. The data obtained maintained uniformity to the extent required by the scope of this study, and potential sources of error have been identified and should be the subject of further research. / System requirements: World Wide Web browser and PDF reader. / Mode of access: World Wide Web.

This research aims to understand the reliability of Sn-Ag-Cu solder interconnects used in plastic ball grid array (PBGA) packages using microstructure evolution, laser moiré interferometry and finite-element modeling. A particle coarsening based microstructure evolution of the solder joint material during thermal excursions was studied for extended periods of time lasting for several months. The microstructure evolution and particle coarsening was quantified, and acceleration factors were determined between benign field-use conditions and accelerated thermal cycling (ATC) conditions for PBGA packages with different form factors and for two different lead-free solder alloys. A new technique using laser moiré interferometry was developed to assess the deformation behavior of Sn-Ag-Cu based solder joints during thermal excursions. This technique can used to estimate the fatigue life of solder joints quickly in a matter of few days instead of months and can be extended to cover a wide range of temperature regimes. Finite-element analysis (FEA) in conjunction with experimental data from the ATC for different lead-free PBGA packages was used to develop a fatigue life model that can be used to predict solder joint fatigue life for any PBGA package. The proposed model will be able to predict the mean number of cycles required for crack initiation and crack growth rate in a solder joint.