The Coffin-Manson equations of Sn/Ag/Cu and Sn/Pb solder joints are presented in this thesis. The experimental results of CSP thermal cycle fatigue test and ball shear test are used to formulate Coffin-Manson equations. The maximum amplitude of equivalent plastic shear strain corresponding to these two experiments are employed. The MARC finite element package is used to calculate the plastic shear strain. Different published fatigue experiment results have been used to show the accuracy and the feasibility of these proposed equations. The 3-D finite element models of the BGA type¡¦s CSP and VCSEL assembly are employed to simulate the thermal cycling fatigue. Results indicate that the fatigue lifes of solder predicted by using the proposed equations have good agreement with those measured from experimental tests.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0724104-002112 |
| Date | 24 July 2004 |
| Creators | Wu, Cheng-Hua |
| Contributors | Der-Min Tsay, Jao-Hwa Kuang, Yung-Chuan Chen, Chi-Hui Chien, Ying-Chien Tsai |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0724104-002112 |
| Rights | not_available, Copyright information available at source archive |
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