Return to search

Adhesion of sputtered copper to plasma-treated polyimide substances /

Thesis (M.S.)--Rochester Institute of Technology, 1991. / Typescript. Includes bibliographical references.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/27423072
Date January 1991
CreatorsMa, Jong-Bong.
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
SourceOnline version of thesis

Page generated in 0.0019 seconds