Differential signaling is suitable for high speed signal transmission due to lower noise induction and higher common-mode noise rejection compared to its single-ended signaling counterpart. However, for a high performance differential transmission-line pair, excellent symmetry and appropriate design for substrate layer stack-up is necessary. Especially for a practical IC package substrate, differential transmission-line pair is inevitable for asymmetry because of considering the locations of IC pads and solderballs. Furthermore, different differential transmission-line pair architectures are also demanded in consideration of limited substrate floorplan space and substrate layer stack-up structures. In this thesis, several differential pairs have been implemented on the conventional 4-layer laminate package substrate. The consequent high frequency performances are measured using vector network analyzer and then compared by converting into mixed-mode S-parameters.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0718107-013034 |
| Date | 18 July 2007 |
| Creators | Huang, Chih-yi |
| Contributors | Chih-wen Kuo, Chih-Pin Hung, Sung-mao Wu, Tzyy-sheng Horng, Ken-huang Lin |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0718107-013034 |
| Rights | unrestricted, Copyright information available at source archive |
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