Return to search

Test Quality Analysis and Improvement for an Embedded Asynchronous FIFO

<p>NXP Semiconductors (formerly Philips Semiconductors) has created a new embedded asynchronous FIFO module. It is a small and fast full-custom design with Design-for-Test (DfT) functionality. The fault detection qualities of a proposed manufacturing test for this FIFO have been analyzed by a defect-based method based on analog simulation. Resistive bridges and opens of different sizes in the bit-cell matrix and in the asynchronous control have been investigated.</p><p>The fault coverage for bridge defects in the bit-cell matrix of the initial FIFO test has been improved by inclusion of an additional data background and low-voltage testing. 100% fault coverage is reached for low resistance bridges. The fault coverage for opens has been improved by a new test procedure including waiting periods.</p><p>98.4% of the hard bridge defects in the asynchronous control slices can be detected with some modifications of the initial test.</p>

Identiferoai:union.ndltd.org:UPSALLA/oai:DiVA.org:liu-9942
Date January 2007
CreatorsDubois, Tobias
PublisherLinköping University, Department of Computer and Information Science, Institutionen för datavetenskap
Source SetsDiVA Archive at Upsalla University
LanguageEnglish
Detected LanguageEnglish
TypeStudent thesis, text

Page generated in 0.0013 seconds