In this study,The bottom electrode(TiN),middle insulator(Hf:SiOx),and top electrode(Pt) were deposited respectively by sputtering technique for fabricating the RRAM with MIM structure.The mole fraction of hafnium were about 5%.Instead of non-doped SiO2 base device has no switching characteristic,the Hf-doped SiO2 RRAM could be operator over 100 times and resistive state was kept stable over 104 second.
In this researches,the double layer structure(Pt/Hf:SiO2/Hf:SiO2(doped N2 and NH3)).The Resistance switching characteristics of double layer structure device has particular I-V characteristics due to the doping of N.The doping of NH3 cause hydrogen plasma treatment on double layer device also bring about particular I-V characteristics. The physical mechanism we had proposed were proof by the Current-Voltage fitting and the material analysis.By control stop-voltage,the double layer structure device can operation by multi-bit.
The detail physical mechanism is studied by the stable RRAM device(Ti/HfO2/TiN).In this study,the model of reset process we had proposed were proof by the special measurement methods(Constant-voltage sampling) and the principle of chemical reaction mechanism.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0828112-162109 |
| Date | 28 August 2012 |
| Creators | Chu, Tian-Jian |
| Contributors | Der-Shin Gan, Tsung-Ming Tsai, Ting-Chahg Chang |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0828112-162109 |
| Rights | user_define, Copyright information available at source archive |
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