by Wong Chi-Wing. / Thesis (M.B.A.)--Chinese University of Hong Kong, 1991. / Includes bibliographical references. / ABSTRACT --- p.ii / TABLE OF CONTENTS --- p.iv / LIST OF TABLES --- p.vi / ACKNOWLEDGEMENTS --- p.vii / Chapter / Chapter I. --- INTRODUCTION --- p.1 / Determinants of Job Satisfaction --- p.3 / Subject of Study --- p.7 / Pilot Interviews --- p.8 / Objectives of the Study --- p.11 / Hypotheses --- p.12 / Chapter II. --- METHODOLOGY --- p.13 / Population Frame and Sample Frame --- p.13 / Data Collection --- p.14 / Questionnaire Design --- p.14 / Data Analysis --- p.17 / Chapter III. --- RESULTS --- p.19 / Descriptive Statistics of Respondents --- p.19 / Reliability Analysis --- p.20 / Factor Analysis --- p.20 / Descriptive Statistics of Variables --- p.21 / Analysis of Variance --- p.22 / Correlation Among Variables --- p.23 / Multiple Regression Analysis --- p.24 / Chapter IV. --- DISCUSSION --- p.27 / General Situation of Engineers in Electronics Manufacturing Field --- p.27 / Correlation Among Overall Job Satisfaction and Other Variables --- p.29 / Factors Constituting Overall Job Satisfaction --- p.31 / Recommendations --- p.33 / Limitation of the Study --- p.35 / Suggestion for Further Research --- p.36 / Chapter V. --- SUMMARY --- p.37 / APPENDIX / Chapter I. --- Survey Questionnaire --- p.57 / Chapter II. --- Variables Investigated in the Study --- p.61 / Chapter III. --- SPSS/PC Command Programme --- p.52 / BIBLIOGRAPHY --- p.67
Identifer | oai:union.ndltd.org:cuhk.edu.hk/oai:cuhk-dr:cuhk_318694 |
Date | January 1991 |
Contributors | Wong, Chi-Wing., Chinese University of Hong Kong Graduate School. Division of Business Administration. |
Publisher | Chinese University of Hong Kong |
Source Sets | The Chinese University of Hong Kong |
Language | English |
Detected Language | English |
Type | Text, bibliography |
Format | print, vii, 69 leaves ; 30 cm. |
Coverage | China, Hong Kong, China, Hong Kong, China, Hong Kong |
Rights | Use of this resource is governed by the terms and conditions of the Creative Commons “Attribution-NonCommercial-NoDerivatives 4.0 International” License (http://creativecommons.org/licenses/by-nc-nd/4.0/) |
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