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In-process stress analysis of flip chip assemblies during underfill cure and environmental stress testing

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1. http://hdl.handle.net/1853/19138
2. 476974

Identifer	oai:union.ndltd.org:GATECH/oai:smartech.gatech.edu:1853/19138
Date	08 1900
Creators	Palaniappan, Prema
Publisher	Georgia Institute of Technology
Source Sets	Georgia Tech Electronic Thesis and Dissertation Archive
Detected Language	English
Type	Thesis
Rights	Access restricted to authorized Georgia Tech users only.