NDLTD Global ETD Search
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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.

Search results

Showing 1 to 9 of 9 (0.099 seconds)

Spelling suggestions: "subject:"6electronic packaging eliability"" "subject:"6electronic packaging deliability""

1

Thermo-mechanical behavior and reliability of High Density Interconnect (HDI) vias

Smith, Kyle Edward 08 1900 (has links)
No description available.
Electronic packaging Reliability
2

Prediction and validation of thermomechanical reliability in electronic packaging

Ding, Hai 08 1900 (has links)
No description available.
Electronic packaging Reliability
Electronic packaging Design
3

Asymmetric thermal cycles : a different approach to accelerated reliability assessment of microelectronic packages

Classe, Francis Christopher 08 1900 (has links)
No description available.
Chip scale packaging Reliability
Electronic packaging Reliability
4

Thermo-mechanical reliability of the VSPA package solder joints

Murphy, R. Sean 12 1900 (has links)
No description available.
Solder and soldering Testing
Electronic packaging Reliability
Electronic packaging Testing
5

Enhance thermomechanical reliability of microsystems packaging through new base substrate and dielectric materials

Hegde, Shashikant 05 1900 (has links)
No description available.
Electronic packaging Reliability
Electronic packaging Thermal fatigue
Dielectric devices
6

High throughput flip chip assembly process and reliability analysis using no-flow underfill materials

Thorpe, Ryan 05 1900 (has links)
No description available.
Electronic packaging Materials
Electronic packaging Reliability
Surface mount technology
7

In-process stress analysis of flip chip assemblies during underfill cure and environmental stress testing

Palaniappan, Prema 08 1900 (has links)
No description available.
Electronic packaging Testing
Electronic packaging Reliability
Strains and stresses
8

Physics-based process modeling, reliability prediction, and design guidelines for flip-chip devices

Michaelides, Stylianos 08 1900 (has links)
No description available.
Integrated circuits Reliability
Electronic packaging Reliability
Electronic packaging Design
9

Damage metric-based thermal cycling guidelines for area-array packages used in harsh thermal conditions

Pyland, James 05 1900 (has links)
No description available.
Electronic packaging Reliability
Solder and soldering Reliability
Solder and soldering Thermal fatigue
Electronic packaging Thermal fatigue

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