NDLTD Global ETD Search
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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.

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Showing 1 to 2 of 2 (0.108 seconds)

Spelling suggestions: "subject:"colder anda solder eliability"" "subject:"colder anda solder deliability""

1

Development of convective reflow-projection moire warpage measurement system and prediction of solder bump reliability on board assemblies affected by warpage

Tan, Wei. January 2008 (has links)
Thesis (Ph. D.)--Mechanical Engineering, Georgia Institute of Technology, 2008. / Committee Chair: Dr. Ume, I. Charles; Committee Member: Dr. Book, Wayne; Committee Member: Dr. Kim, Yeong; Committee Member: Dr. Pan, Jiahui; Committee Member: Dr. Sitaraman, Suresh; Committee Member: Dr. Wu, C. F. Jeff.
2

Damage metric-based thermal cycling guidelines for area-array packages used in harsh thermal conditions

Pyland, James 05 1900 (has links)
No description available.
Electronic packaging Reliability
Solder and soldering Reliability
Solder and soldering Thermal fatigue
Electronic packaging Thermal fatigue

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