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Test Quality Analysis and Improvement for an Embedded Asynchronous FIFO

NXP Semiconductors (formerly Philips Semiconductors) has created a new embedded asynchronous FIFO module. It is a small and fast full-custom design with Design-for-Test (DfT) functionality. The fault detection qualities of a proposed manufacturing test for this FIFO have been analyzed by a defect-based method based on analog simulation. Resistive bridges and opens of different sizes in the bit-cell matrix and in the asynchronous control have been investigated. The fault coverage for bridge defects in the bit-cell matrix of the initial FIFO test has been improved by inclusion of an additional data background and low-voltage testing. 100% fault coverage is reached for low resistance bridges. The fault coverage for opens has been improved by a new test procedure including waiting periods. 98.4% of the hard bridge defects in the asynchronous control slices can be detected with some modifications of the initial test.

Identiferoai:union.ndltd.org:UPSALLA1/oai:DiVA.org:liu-9942
Date January 2007
CreatorsDubois, Tobias
PublisherLinköpings universitet, Institutionen för datavetenskap, Institutionen för datavetenskap
Source SetsDiVA Archive at Upsalla University
LanguageEnglish
Detected LanguageEnglish
TypeStudent thesis, info:eu-repo/semantics/bachelorThesis, text
Formatapplication/pdf
Rightsinfo:eu-repo/semantics/openAccess

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