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The Fabrication of Laser Array Module by Flip Chip Technique

We have fabricated a laser array module using a passive self-aligned flip-chip bonding technique. Silicon optical bench was used as a submount with PbSn (Tm=183¢J) solder bump and V-grooves. A 4-channel laser array was flip-chip mounted with coupling efficiency of 56% to cleaved 62.5/125£gm multimode fiber ribbons. The optimum fabrication parameters were bonding time of 20 seconds and bonding load of 10g. The average misalignments were measured to be 1£gm and 5£gm for X and Y directions , respectively.

Identiferoai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0112101-132614
Date12 January 2001
CreatorsHsieh, Cheng-Han
ContributorsSheng-Lung Huang, Jao-Hwa Kuang, Weng-Jin Wu, Wood-Hi Cheng, Tsong-Sheng Lay, An-Kuo Chu
PublisherNSYSU
Source SetsNSYSU Electronic Thesis and Dissertation Archive
LanguageCholon
Detected LanguageEnglish
Typetext
Formatapplication/pdf
Sourcehttp://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0112101-132614
Rightscampus_withheld, Copyright information available at source archive

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