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The Study of Alignment Shift in Flip-Chip Bonding for VCSEL Array

The study of alignment shift in flip chip bonding for VCSEL array was studied experimentally. We calculated the relation between the restoring force and the solder volume by the simulation software PadCAD. The metal pad size were 10£gm, 20£gm, 30£gm in diameter shape and 40£gm in square shape. The solder bump was electroplat by bidirection pulse in the silicon bench which was evaporated by Au/Pt/Ti. The oxidization in the surface of the solder was removed by using flux.
The VCSEL array and the Si-bench in flip chip bonding was operated at the temperature 210¢J and 5 seconds. After the flip chip bonding, the minimum alignment shift in X direction was measured to be 2.2£gm. Base on the alignment shift measured result, the maximum coupling efficiency was calculated to be 48% for VCSEL array module.

Identiferoai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0625101-223132
Date25 June 2001
CreatorsChen, Cong-Ching
ContributorsWeng-Jin Wu, Wood-Hi Cheng, Ching-Tin Lee, Jao-Hwa Kuang, Ker-Chang Hsirh
PublisherNSYSU
Source SetsNSYSU Electronic Thesis and Dissertation Archive
LanguageCholon
Detected LanguageEnglish
Typetext
Formatapplication/pdf
Sourcehttp://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0625101-223132
Rightsnot_available, Copyright information available at source archive

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