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Flip chip and lid attachment assembly process development

Dissertation (Ph.D.)--Auburn University, 2006. / Abstract. Includes bibliographic references (p.99-110).

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/244012992
Date January 2006
CreatorsDing, Fei, Johnson, Robert Wayne,
PublisherAuburn, Ala. ,
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish

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